Home > Semiconductors & Electronics > Semiconductor > Semiconductor Packaging > 3D IC and 2.5D IC Packaging Market

3D IC and 2.5D IC Packaging Market Size

Report ID: GMI5933
Published Date: Jun 2023
Report Format: PDF

Download Free Sample

3D IC and 2.5D IC Packaging Market Size

3D IC and 2.5D IC packaging market was valued at over USD 45 billion in 2022 and is anticipated to grow at a CAGR of over 9% between 2023 and 2032. Advancements in manufacturing equipment are driving growth in the industry. Improvements in wafer thinning, bonding, manufacturing processes have made this packaging process more efficient and cost-effective.

3D IC and 2.5D IC packaging market

To get key market trends

Download Free Sample

In addition, 3D IC and 2.5D IC packaging solutions enable the integration of various sensors, processors, and memory components into a compact form factor, enabling real-time data processing, low latency, and efficient power management that are crucial in AR devices.

3D IC and 2.5D IC Packaging Market Report Attributes
Report Attribute	Details
Base Year:	2022
3D IC and 2.5D IC Packaging Market Size in 2022:	USD 45Billion
Forecast Period:	2023 to 2032
Forecast Period 2023 to 2032 CAGR:	9%
2032 Value Projection:	USD 110 Billion
Historical Data for:	2018 – 2022
No. of Pages:	252
Tables, Charts & Figures:	260
Segments covered:	Technology, Application, End-Use, and Region
Growth Drivers:	Increasing need for advanced architecture in electronic products Advancement in manufacturing technology Rising trend of miniaturization of electronic devices Surge in demand for consumer electronics
Pitfalls & Challenges:	High implementation cost Design complexity

Learn more about the key segments shaping this market

Download Free Sample

3D IC packaging refers to the integration of multiple layers or dies vertically, creating a three-dimensional structure. While on the other hand, 2.5D IC packaging involves the integration of multiple dies or chips onto a silicon interposer or an organic substrate.

The increasing implementation cost can limit market growth. 3D IC and 2.5D IC packaging is cost prohibitive. The techniques & methods associated with this packaging process will require additional investments in materials, equipment, and expertise. This can deter some smaller or budget-constrained organizations from embracing these technologies, hindering market growth.

Authors: Suraj Gujar

Frequently Asked Questions (FAQ) :

Market size for 3D IC and 2.5D IC packaging was USD 45 billion in 2022 and will record over 9% CAGR between 2023 and 2032.

The 3D wafer-level chip-scale market held over 25% share by 2022 as 3D WLCSP refers to a packaging technology where multiple chips or dies are stacked vertically and the interconnections between them are made at the wafer level.

Asia Pacific 3D IC and 2.5D IC packaging industry will observe over 10% CAGR from 2023 to 2032 as it is home to some of the largest semiconductor chip manufacturers including TSMC, SMIC, UMC, and Samsung.

Amkor Technology, ChipMOS Technologies Inc., Texas Instrument, Intel Corporation, Mitsubishi Electric Corporation, Samsung Electronics, Advanced Semiconductor Engineering (ASE), Broadcom, Toshiba Corporation, Xilinx Inc., and United Microelectronics Corporation (UMC).