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Premium Report Details
Base Year: 2022
Companies covered: 15
Tables & Figures: 260
Countries covered: 18
Pages: 252
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3D IC and 2.5D IC Packaging Market
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3D IC and 2.5D IC Packaging Market Size
3D IC and 2.5D IC packaging market was valued at over USD 45 billion in 2022 and is anticipated to grow at a CAGR of over 9% between 2023 and 2032. Advancements in manufacturing equipment are driving growth in the industry. Improvements in wafer thinning, bonding, manufacturing processes have made this packaging process more efficient and cost-effective.
In addition, 3D IC and 2.5D IC packaging solutions enable the integration of various sensors, processors, and memory components into a compact form factor, enabling real-time data processing, low latency, and efficient power management that are crucial in AR devices.
3D IC packaging refers to the integration of multiple layers or dies vertically, creating a three-dimensional structure. While on the other hand, 2.5D IC packaging involves the integration of multiple dies or chips onto a silicon interposer or an organic substrate.
The increasing implementation cost can limit market growth. 3D IC and 2.5D IC packaging is cost prohibitive. The techniques & methods associated with this packaging process will require additional investments in materials, equipment, and expertise. This can deter some smaller or budget-constrained organizations from embracing these technologies, hindering market growth.