3D IC and 2.5D IC Packaging Market Size

Report ID: GMI5933
   |
Published Date: June 2023
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Report Format: PDF

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3D IC and 2.5D IC Packaging Market Size

3D IC and 2.5D IC packaging market was valued at over USD 45 billion in 2022 and is anticipated to grow at a CAGR of over 9% between 2023 and 2032. Advancements in manufacturing equipment are driving growth in the industry. Improvements in wafer thinning, bonding, manufacturing processes have made this packaging process more efficient and cost-effective.

 

3D IC and 2.5D IC packaging market

In addition, 3D IC and 2.5D IC packaging solutions enable the integration of various sensors, processors, and memory components into a compact form factor, enabling real-time data processing, low latency, and efficient power management that are crucial in AR devices.
 

3D IC packaging refers to the integration of multiple layers or dies vertically, creating a three-dimensional structure. While on the other hand, 2.5D IC packaging involves the integration of multiple dies or chips onto a silicon interposer or an organic substrate.
 

The increasing implementation cost can limit market growth. 3D IC and 2.5D IC packaging is cost prohibitive. The techniques & methods associated with this packaging process will require additional investments in materials, equipment, and expertise. This can deter some smaller or budget-constrained organizations from embracing these technologies, hindering market growth.

Authors: Suraj Gujar,
Frequently Asked Question(FAQ) :
How much is the 2032 market forecast for 3D IC and 2.5D IC packaging?
Market size for 3D IC and 2.5D IC packaging was USD 45 billion in 2022 and will record over 9% CAGR between 2023 and 2032.
Why is the 3D wafer-level chip-scale packaging demand increasing?
Which of the key factors is driving the Asia Pacific 3D IC and 2.5D IC packaging market?
Who are the leading manufacturers in the global 3D IC and 2.5D IC packaging market?
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    Base Year: 2022

    Companies covered: 15

    Tables & Figures: 260

    Countries covered: 18

    Pages: 252

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