Report Content
Chapter 1 Methodology & Scope
1.1 Scope & definition
1.2 Methodology and forecast parameters
1.3 Data Sources
1.3.1 Secondary
1.3.2 Primary
Chapter 2 Executive Summary
2.1 Thin wafer 3600 synopsis, 2016 – 2027
2.1.1 Business trends
2.1.2 Regional trends
2.1.3 Thickness trends
2.1.4 Wafer size trends
2.1.5 Process trends
2.1.6 Application trends
Chapter 3 Thin Wafer: Industry Insights
3.1 Industry Segmentation
3.2 Impact analysis of corona virus (COVID-19) pandemic on the thin wafer market
3.2.1 Global outlook
3.2.2 Impact by region
3.2.2.1 North America
3.2.2.2 Europe
3.2.2.3 Asia Pacific
3.2.2.4 LAMEA
3.2.3 Industry value chain
3.2.3.1 Research & development
3.2.3.2 Manufacturing
3.2.3.3 Marketing
3.2.3.4 Supply
3.2.4 Competitive landscape
3.2.4.1 Strategy
3.2.4.2 Distribution network
3.2.4.3 Business growth
3.3 Industry ecosystem analysis
3.3.1 Raw material supplier
3.3.2 Manufacturer
3.3.3 Distribution channel analysis
3.3.4 End use OEMs
3.3.5 Vendor Matrix
3.4 Wafer size evolution
3.5 Equipment involved in wafer manufacturing
3.6 Technology and innovation landscape
3.6.1 Process involved in thin silicon wafer:
3.6.2 Recent developments
3.6.2.1 Processing technique for fabrication of ultra-thin wafer
3.6.2.2 Temporary polymer bonding used in thin wafer manufacturing
3.6.2.3 Thin wafer cleaning system (ACM Research):
3.7 Regulatory landscape
3.7.1 International Standards
3.7.1.1 SEMI M1
3.7.1.2 SEMI MF1618
3.7.1.3 ISO 14706:2000
3.7.1.4 ISO 14001
3.7.1.5 IEEE P1735
3.7.2 North America
3.7.2.1 SEMI M1.2-89
3.7.2.2 OSHA
3.7.2.3 Supplier’s Declaration of Conformity (SDoC)
3.7.3 Europe
3.7.3.1 ROHS
3.7.3.2 2006/42/EC
3.7.4 Asia Pacific
3.7.4.1 The Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors (SPECS)
3.7.4.2 Regulations on the Protection of Layout-Designs of Integrated Circuits (2001)
3.7.4.3 The China Certification and Accreditation Administration (CNCA)
3.7.4.4 Technical Standards Compliance Self-Check
3.8 Industry impact forces
3.8.1 Growth drivers
3.8.1.1 Expanding IC industry in China
3.8.1.2 Growing adoption of IoT and AI in the automotive sector
3.8.1.3 Growing smartphone and consumer electronics market
3.8.1.4 Increasing focus on e-learning amid COVID-19 drives demand for smartphones, tablets, and laptops
3.8.1.5 Reducing sizes of electronic devices
3.8.1.6 Rising adoption of MEMS technology in portable health monitoring devices
3.8.2 Pitfall & challenges
3.8.2.1 Thin wafers are volatile and susceptible to damage caused by pressure or stress
3.8.2.2 Efficiency maintenance is a major issue in thin wafers
3.8.2.3 Delay in investment plans for capacity expansion by wafer manufacturers due to COVID-19
3.9 Growth potential analysis
3.10 Porter’s Analysis
3.10.1 Bargaining power of suppliers
3.10.2 Bargaining power of buyers
3.10.3 Threat of new entrants
3.10.4 Threat of substitutes
3.11 PESTEL analysis
Chapter 4 Competitive Landscape,
4.1 Introduction
4.1 Company market share, 2020
4.2 Competitive analysis of major market players, 2020
4.2.1 SK siltron Co., Ltd.
4.2.2 Siltronic AG
4.2.3 Shin-Etsu Chemical Co., Ltd.
4.2.4 SUMCO CORPORATION
4.2.5 GlobalWafers
4.3 Competitive analysis of innovation leaders, 2020
4.3.1 SOITEC
4.3.2 Shanghai Simgui Technology Co., Ltd.
4.3.3 Sil'tronix Silicon Technologies
4.3.4 UniversityWafer, Inc.
4.3.5 Silicon Valley Microelectronics, Inc.
Chapter 5 Thin Wafer Market, By Thickness
5.1 Key trends by thickness
5.2 >200 μm
5.2.1 Market estimates and forecasts, 2016 – 2027
5.3 100 μm-199 μm
5.3.1 Market estimates and forecasts, 2016 – 2027
5.4 50 μm-99 μm
5.4.1 Market estimates and forecasts, 2016 – 2027
5.5 30 μm-49 μm
5.5.1 Market estimates and forecasts, 2016 – 2027
5.6 10 μm-29 μm
5.6.1 Market estimates and forecasts, 2016 – 2027
5.7 <10 μm
5.7.1 Market estimates and forecasts, 2016 – 2027
Chapter 6 Thin Wafer Market, By Wafer Size
6.1 Key trends by wafer size
6.2 100 mm
6.2.1 Market estimates and forecasts, 2016 – 2027
6.3 125 mm
6.3.1 Market estimates and forecasts, 2016 – 2027
6.4 200 mm
6.4.1 Market estimates and forecasts, 2016 – 2027
6.5 300 mm
6.5.1 Market estimates and forecasts, 2016 – 2027
Chapter 7 Thin Wafer Market, By Process
7.1 Key trends, by process
7.2 Temporary bonding & debonding
7.2.1 Market estimates and forecasts, 2016 – 2027
7.2.2 UV-release adhesives
7.2.2.1 Market estimates and forecasts, 2016 – 2027
7.2.3 Thermal-release adhesives
7.2.3.1 Market estimates and forecasts, 2016 – 2027
7.2.4 Solvent-release adhesives
7.2.4.1 Market estimates and forecasts, 2016 – 2027
7.3 Carrier-less approach/Taiko process
7.3.1 Market estimates and forecasts, 2016 – 2027
Chapter 8 Thin Wafer Market, By Application
8.1 Key trends, by application
8.2 MEMS
8.2.1 Market estimates and forecasts, 2016 – 2027
8.3 CMOS image sensors
8.3.1 Market estimates and forecasts, 2016 – 2027
8.4 Memory
8.4.1 Market estimates and forecasts, 2016 – 2027
8.5 RF devices
8.5.1 Market estimates and forecasts, 2016 – 2027
8.6 LED
8.6.1 Market estimates and forecasts, 2016 – 2027
8.7 Interposers
8.7.1 Market estimates and forecasts, 2016 – 2027
8.8 Logic
8.8.1 Market estimates and forecasts, 2016 – 2027
8.9 Others
8.9.1 Market estimates and forecasts, 2016 – 2027
Chapter 9 Thin wafer Market, By Region
9.1 Key trends by region
9.2 North America
9.2.1 Market estimates and forecast, by thickness, 2016 - 2027
9.2.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.2.3 Market estimates and forecast, by process, 2016 - 2027
9.2.4 Market estimates and forecast, by application, 2016 – 2027
9.2.5 U.S.
9.2.5.1 Market estimates and forecast, by thickness, 2016 - 2027
9.2.5.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.2.5.3 Market estimates and forecast, by process, 2016 - 2027
9.2.5.4 Market estimates and forecast, by applications, 2016 – 2027
9.2.6 Canada
9.2.6.1 Market estimates and forecast, by thickness, 2016 - 2027
9.2.6.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.2.6.3 Market estimates and forecast, by process, 2016 - 2027
9.2.6.4 Market estimates and forecast, by applications, 2016 – 2027
9.3 Europe
9.3.1 Market estimates and forecast, by thickness, 2016 - 2027
9.3.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.3.3 Market estimates and forecast, by process, 2016 - 2027
9.3.4 Market estimates and forecast, by application, 2016 – 2027
9.3.5 Germany
9.3.5.1 Market estimates and forecast, by thickness, 2016 - 2027
9.3.5.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.3.5.3 Market estimates and forecast, by process, 2016 - 2027
9.3.5.4 Market estimates and forecast, by applications, 2016 – 2027
9.3.6 France
9.3.6.1 Market estimates and forecast, by thickness, 2016 - 2027
9.3.6.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.3.6.3 Market estimates and forecast, by process, 2016 - 2027
9.3.6.4 Market estimates and forecast, by applications, 2016 – 2027
9.3.7 Italy
9.3.7.1 Market estimates and forecast, by thickness, 2016 - 2027
9.3.7.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.3.7.3 Market estimates and forecast, by process, 2016 - 2027
9.3.7.4 Market estimates and forecast, by applications, 2016 – 2027
9.3.8 Russia
9.3.8.1 Market estimates and forecast, by thickness, 2016 - 2027
9.3.8.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.3.8.3 Market estimates and forecast, by process, 2016 - 2027
9.3.8.4 Market estimates and forecast, by applications, 2016 – 2027
9.4 Asia Pacific
9.4.1 Market estimates and forecast, by thickness, 2016 - 2027
9.4.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.4.3 Market estimates and forecast, by process, 2016 - 2027
9.4.4 Market estimates and forecast, by application, 2016 – 2027
9.4.5 China
9.4.5.1 Market estimates and forecast, by thickness, 2016 - 2027
9.4.5.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.4.5.3 Market estimates and forecast, by process, 2016 - 2027
9.4.5.4 Market estimates and forecast, by applications, 2016 – 2027
9.4.6 Japan
9.4.6.1 Market estimates and forecast, by thickness, 2016 - 2027
9.4.6.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.4.6.3 Market estimates and forecast, by process, 2016 - 2027
9.4.6.4 Market estimates and forecast, by applications, 2016 – 2027
9.4.7 South Korea
9.4.7.1 Market estimates and forecast, by thickness, 2016 - 2027
9.4.7.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.4.7.3 Market estimates and forecast, by process, 2016 - 2027
9.4.7.4 Market estimates and forecast, by applications, 2016 – 2027
9.4.8 Taiwan
9.4.8.1 Market estimates and forecast, by thickness, 2016 - 2027
9.4.8.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.4.8.3 Market estimates and forecast, by process, 2016 - 2027
9.4.8.4 Market estimates and forecast, by applications, 2016 – 2027
9.4.9 Singapore
9.4.9.1 Market estimates and forecast, by thickness, 2016 - 2027
9.4.9.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.4.9.3 Market estimates and forecast, by process, 2016 - 2027
9.4.9.4 Market estimates and forecast, by applications, 2016 – 2027
9.5 LAMEA
9.5.1 Market estimates and forecast, by thickness, 2016 - 2027
9.5.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.5.3 Market estimates and forecast, by process, 2016 - 2027
9.5.4 Market estimates and forecast, by application, 2016 – 2027
9.5.5 Brazil
9.5.5.1 Market estimates and forecast, by thickness, 2016 - 2027
9.5.5.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.5.5.3 Market estimates and forecast, by process, 2016 - 2027
9.5.5.4 Market estimates and forecast, by applications, 2016 – 2027
9.5.6 Israel
9.5.6.1 Market estimates and forecast, by thickness, 2016 - 2027
9.5.6.2 Market estimates and forecast, by wafer size, 2016 - 2027
9.5.6.3 Market estimates and forecast, by process, 2016 - 2027
9.5.6.4 Market estimates and forecast, by applications, 2016 – 2027
Chapter 10 Company Profiles
10.1 GlobalWafers
10.1.1 Business Overview
10.1.2 Financial Data
10.1.3 Product Landscape
10.1.4 Go-To-Market Strategy
10.1.5 SWOT Analysis
10.2 IceMOS Technology Ltd.
10.2.1 Business Overview
10.2.2 Financial Data
10.2.3 Product Landscape
10.2.4 Go-To-Market Strategy
10.2.5 SWOT Analysis
10.3 Polishing Corporation of America
10.3.1 Business Overview
10.3.2 Financial Data
10.3.3 Product Landscape
10.3.4 SWOT Analysis
10.4 Shanghai Simgui Technology Co. Ltd.
10.4.1 Business Overview
10.4.2 Financial Data
10.4.3 Product Landscape
10.4.4 Go-To-Market Strategy
10.4.5 SWOT Analysis
10.5 Shin-Etsu Chemical Co., Ltd.
10.5.1 Business Overview
10.5.2 Financial Data
10.5.3 Product Landscape
10.5.4 Go-To-Market Strategy
10.5.5 SWOT Analysis
10.6 Silicon Valley Microelectronics, Inc
10.6.1 Business Overview
10.6.2 Financial Data
10.6.3 Product Landscape
10.6.4 Go-to-market-strategies
10.6.5 SWOT Analysis
10.7 Siltronic AG
10.7.1 Business Overview
10.7.2 Financial Data
10.7.3 Product Landscape
10.7.4 Go-To-Market Strategy
10.7.5 SWOT Analysis
10.8 Sil'tronix Silicon Technologies
10.8.1 Business Overview
10.8.2 Financial Data
10.8.3 Product Landscape
10.8.4 Go-To-Market Strategy
10.8.5 SWOT Analysis
10.9 SK Siltron Co., Ltd.
10.9.1 Business Overview
10.9.2 Financial Data
10.9.3 Product Landscape
10.9.4 Go-To-Market Strategy
10.9.5 SWOT Analysis
10.10 SOITEC
10.10.1 Business Overview
10.10.2 Financial Data
10.10.3 Product Landscape
10.10.4 Go-To-Market Strategy
10.10.5 SWOT Analysis
10.11 SUMCO CORPORATION
10.11.1 Business Overview
10.11.2 Financial Data
10.11.3 Product Landscape
10.11.4 Go-To-Market Strategy
10.11.5 SWOT Analysis
10.12 UniversityWafer, Inc
10.12.1 Business Overview
10.12.2 Financial Data
10.12.3 Product Landscape
10.12.4 Go-To-Market-Strategy
10.12.5 SWOT Analysis
10.13 Virginia Semiconductor Inc.
10.13.1 Business Overview
10.13.2 Financial Data
10.13.3 Product Landscape
10.13.4 Go-To-Market Strategy
10.13.5 SWOT Analysis
10.14 Wafer World Inc.
10.14.1 Business Overview
10.14.2 Financial Data
10.14.3 Product Landscape
10.14.4 Go-To-Market Strategy
10.14.5 SWOT Analysis
10.15 WaferPro
10.15.1 Business Overview
10.15.2 Financial Data
10.15.3 Product Landscape
10.15.4 Go-To-Market Strategy
10.15.5 SWOT Analysis
