Report Content
Chapter 1 Scope & Methodology
1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast parameters
1.4 Data sources
1.4.1 Primary
1.4.2 Secondary
1.4.2.1 Paid sources
1.4.2.2 Public sources
Chapter 2 Executive Summary
2.1 Industry 3600 synopsis, 2024 - 2032
2.2 Business trends
2.2.1 Total addressable market (TAM), 2024-2032
Chapter 3 Industry Insights
3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Technology & innovation landscape
3.4 Patent analysis
3.5 Key news and initiatives
3.6 Regulatory landscape
3.7 Impact forces
3.7.1 Growth drivers
3.7.1.1 Rising adoption of Electric Vehicles (EVs)
3.7.1.2 Increased demand for renewable energy
3.7.1.3 Advancements in power electronics
3.7.1.4 Technological innovations and advancements
3.7.1.5 Expansion of telecommunication infrastructure
3.7.2 Industry pitfalls & challenges
3.7.2.1 High manufacturing costs
3.7.2.2 Technical complexity and integration issues
3.8 Growth potential analysis
3.9 Porter’s analysis
3.9.1 Supplier power
3.9.2 Buyer power
3.9.3 Threat of new entrants
3.9.4 Threat of substitutes
3.9.5 Industry rivalry
3.10 PESTEL analysis
Chapter 4 Competitive Landscape, 2023
4.1 Company market share analysis
4.2 Competitive positioning matrix
4.3 Strategic outlook matrix
Chapter 5 Market Estimates & Forecast, By Product Type, 2021 - 2032 (USD Million & Units)
5.1 Key trends
5.2 Black silicon carbide
5.3 Green silicon carbide
5.4 Other silicon carbide types
Chapter 6 Market Estimates & Forecast, By Device Type, 2021 - 2032 (USD Million & Units)
6.1 Key trends
6.2 SiC discrete devices
6.2.1 Diodes
6.2.2 MOSFETs
6.2.3 BJTs (Bipolar Junction Transistors)
6.2.4 JFETs (Junction Field Effect Transistors)
6.3 SiC modules
6.4 Other SiC devices
Chapter 7 Market Estimates & Forecast, By Wafer Size, 2021 - 2032 (USD Million & Units)
7.1 Key trends
7.2 2-inch
7.3 4-inch
7.4 6-inch and above
Chapter 8 Market Estimates & Forecast, By Application, 2021 - 2032 (USD Million & Units)
8.1 Key trends
8.2 Power electronics
8.2.1 Power supply and inverter
8.2.2 Wireless charging
8.2.3 Power grid devices
8.2.4 Industrial motor drives
8.2.5 Electric vehicle charging infrastructure
8.2.6 Renewable energy systems
8.3 Optical devices
8.3.1 LED lighting
8.3.2 Photonics
8.3.3 Laser applications
8.3.4 UV detectors
8.4 Sensing
8.4.1 Pressure sensors
8.4.2 Temperature sensors
8.4.3 Gas sensors
8.4.4 Radiation detectors
8.4.5 Other
Chapter 9 Market Estimates & Forecast, By Production Method, 2021 - 2032 (USD Million & Units)
9.1 Key trends
9.2 Acheson process
9.3 Physical vapor transport (PVT)
9.4 Chemical vapor deposition (CVD)
9.5 Other production methods
Chapter 10 Market Estimates & Forecast, By End-Use Industry, 2021 - 2032 (USD Million & Units)
10.1 Key trends
10.2 Automotive
10.3 Aerospace & defense
10.4 Telecommunications
10.5 Energy & power
10.6 Healthcare
10.7 Electronics & semiconductors
10.8 Industrial manufacturing
10.9 Oil & gas
10.10 Mining
10.11 Chemical processing
10.12 Consumer electronics
10.13 Research & development
Chapter 11 Market Estimates & Forecast, By Region, 2021 - 2032 (USD Million & Units)
11.1 Key trends
11.2 North America
11.2.1 U.S.
11.2.2 Canada
11.3 Europe
11.3.1 UK
11.3.2 Germany
11.3.3 France
11.3.4 Italy
11.3.5 Spain
11.3.6 Rest of Europe
11.4 Asia Pacific
11.4.1 China
11.4.2 India
11.4.3 Japan
11.4.4 South Korea
11.4.5 ANZ
11.4.6 Rest of Asia Pacific
11.5 Latin America
11.5.1 Brazil
11.5.2 Mexico
11.5.3 Rest of Latin America
11.6 MEA
11.6.1 UAE
11.6.2 Saudi Arabia
11.6.3 South Africa
11.6.4 Rest of MEA
Chapter 12 Company Profiles
12.1 Central Semiconductor Corp.
12.2 Cree, Inc.
12.3 Danfoss A/S
12.4 Fuji Electric Co., Ltd.
12.5 General Electric Company (GE Aviation)
12.6 GeneSiC Semiconductor Inc.
12.7 Global Power Technologies Group
12.8 Hitachi Power Semiconductor Device, Ltd.
12.9 II‐VI Incorporated
12.10 Infineon Technologies AG
12.11 Littelfuse, Inc.
12.12 Microsemi Corporation
12.13 Mitsubishi Electric Corporation
12.14 NXP Semiconductors N.V.
12.15 ON Semiconductor Corporation
12.16 Power Integrations, Inc.
12.17 Renesas Electronics Corporation
12.18 ROHM Co., Ltd.
12.19 STMicroelectronics N.V.
12.20 Taiyo Yuden Co., Ltd.
12.21 Toshiba Corporation
12.22 United Silicon Carbide, Inc. (USCi)
