Report Content
Chapter 1 Scope & Methodology
1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast parameters
1.4 Data sources
1.4.1 Primary
1.4.2 Secondary
1.4.2.1 Paid sources
1.4.2.2 Public sources
Chapter 2 Executive Summary
2.1 Industry 360º synopsis, 2021 - 2032
Chapter 3 Industry Insights
3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Technology & innovation landscape
3.4 Patent analysis
3.5 Key news and initiatives
3.6 Regulatory landscape
3.7 Impact forces
3.7.1 Growth drivers
3.7.1.1 Growth in semiconductor industry
3.7.1.2 Advancements in technology
3.7.1.3 Expansion of 5G networks
3.7.1.4 The growing adoption of electric vehicles (EVs)
3.7.1.5 Increased Investment in R&D
3.7.2 Industry pitfalls & challenges
3.7.2.1 High initial costs
3.7.2.2 Supply chain disruptions
3.8 Growth potential analysis
3.9 Porter’s analysis
3.9.1 Supplier power
3.9.2 Buyer power
3.9.3 Threat of new entrants
3.9.4 Threat of substitutes
3.9.5 Industry rivalry
3.10 PESTEL analysis
Chapter 4 Competitive Landscape, 2023
4.1 Company market share analysis
4.2 Competitive positioning matrix
4.3 Strategic outlook matrix
Chapter 5 Market Estimates & Forecast, By Bonding Type, 2021 - 2032 (USD Million)
5.1 Key trends
5.2 Permanent bonding
5.3 Temporary bonding
5.4 Hybrid bonding
Chapter 6 Market Estimates & Forecast, By Equipment Type, 2021 – 2032 (USD Million)
6.1 Key trends
6.2 Wire bonding equipment
6.3 Die bonding equipment
6.4 Flip chip Bonding equipment
6.5 Wafer bonding equipment
Chapter 7 Market Estimates & Forecast, By Application, 2021 – 2032 (USD Million)
7.1 Key trends
7.2 Advanced packaging
7.3 Power IC and power discrete
7.4 Photonic devices
7.5 MEMS Sensors and Actuators
7.6 Engineered substrates
7.7 CMOS image sensors
7.8 RF devices
7.9 Others
Chapter 8 Market Estimates & Forecast, By End Use Industry, 2021 – 2032 (USD Million)
8.1 Key trends
8.2 Consumer electronics
8.3 Automotive
8.4 Telecommunications
8.5 Healthcare
8.6 Aerospace & defense
8.7 Industrial
8.8 Others
Chapter 9 Market Estimates & Forecast, By Region, 2021 - 2032 (USD Million)
9.1 Key trends
9.2 North America
9.2.1 U.S.
9.2.2 Canada
9.3 Europe
9.3.1 UK
9.3.2 Germany
9.3.3 France
9.3.4 Italy
9.3.5 Spain
9.3.6 Rest of Europe
9.4 Asia Pacific
9.4.1 China
9.4.2 India
9.4.3 Japan
9.4.4 South Korea
9.4.5 ANZ
9.4.6 Rest of Asia Pacific
9.5 Latin America
9.5.1 Brazil
9.5.2 Mexico
9.5.3 Rest of Latin America
9.6 MEA
9.6.1 UAE
9.6.2 Saudi Arabia
9.6.3 South Africa
9.6.4 Rest of MEA
Chapter 10 Company Profiles
10.1 Applied Materials, Inc.
10.2 Applied Microengineering Ltd.
10.3 ASMPT Ltd (ASM Pacific Technology)
10.4 BE Semiconductor Industries NV (Besi)
10.5 Canon Inc.
10.6 DIAS Automation
10.7 Dr. Tresky AG
10.8 EV Group (EVG)
10.9 Fasford Technology Co., Ltd.
10.10 Hesse GmbH
10.11 Kaijo Shibuya Europe GmbH
10.12 Kulicke and Soffa Industries, Inc.
10.13 MRSI Systems
10.14 Mycronic
10.15 Nidec Corporation
10.16 Palomar Technologies
10.17 Panasonic Connect Co., Ltd.
10.18 Shibaura Mechatronics Corp
10.19 SUSS MicroTec SE
10.20 Tokyo Electron Limited
10.21 TORAY ENGINEERING Co.,Ltd
10.22 TPT Wire Bonder GmbH & Co KG
10.23 Ultrasonic Engineering Co., Ltd.
10.24 WestBond, Inc.
