Report Content
Chapter 1 Methodology & Scope
1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data sources
1.4.1 Primary
1.4.2 Secondary
1.4.2.1 Paid sources
1.4.2.2 Public sources
Chapter 2 Executive Summary
2.1 Industry 3600 synopsis, 2021-2032
Chapter 3 Industry Insights
3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Profit margin analysis
3.4 Technology & innovation landscape
3.5 Patent analysis
3.6 Key news and initiatives
3.7 Regulatory landscape
3.8 Impact forces
3.8.1 Growth drivers
3.8.1.1 Expanding semiconductor applications in industrial automation
3.8.1.2 Advancement in semiconductor technologies
3.8.1.3 Expansion of consumer electronics
3.8.1.4 Proliferation of IoT devices
3.8.1.5 Rising demand for 5G and high-performance computing
3.8.2 Industry pitfalls & challenges
3.8.2.1 Manufacturing complexity and costs
3.8.2.2 Technical and inspection issues
3.9 Growth potential analysis
3.10 Porter’s analysis
3.10.1 Supplier power
3.10.2 Buyer power
3.10.3 Threat of new entrants
3.10.4 Threat of substitutes
3.10.5 Industry rivalry
3.11 PESTEL analysis
Chapter 4 Competitive Landscape, 2023
4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix
Chapter 5 Market Estimates & Forecast, By Type, 2021-2032 (USD Million)
5.1 Key trends
5.2 Organic substrate
5.3 Bonding wires
5.4 Lead frames
5.5 Encapsulation resins
5.6 Ceramic packages
5.7 Die attach materials
5.8 Thermal interface materials
5.9 Others
Chapter 6 Market Estimates & Forecast, By Packaging Technology, 2021-2032 (USD Million)
6.1 Key trends
6.2 Wire bonding
6.3 Flip-chip packaging
6.4 Wafer-level packaging (WLP)
6.5 System-in-package (SiP)
6.6 Others
Chapter 7 Market Estimates & Forecast, By End-Use Industry, 2021-2032 (USD Million)
7.1 Key trends
7.2 Aerospace & defense
7.3 Automotive
7.4 Consumer electronics
7.5 Healthcare
7.6 IT & telecommunication
7.7 Others
Chapter 8 Market Estimates & Forecast, By Region, 2021-2032 (USD Million)
8.1 Key trends
8.2 North America
8.2.1 U.S.
8.2.2 Canada
8.3 Europe
8.3.1 UK
8.3.2 Germany
8.3.3 France
8.3.4 Italy
8.3.5 Spain
8.3.6 Rest of Europe
8.4 Asia Pacific
8.4.1 China
8.4.2 India
8.4.3 Japan
8.4.4 South Korea
8.4.5 ANZ
8.4.6 Rest of Asia Pacific
8.5 Latin America
8.5.1 Brazil
8.5.2 Mexico
8.5.3 Rest of Latin America
8.6 MEA
8.6.1 UAE
8.6.2 South Africa
8.6.3 Saudi Arabia
8.6.4 Rest of MEA
Chapter 9 Company Profiles
9.1 ASE
9.2 Chang Chun Group
9.3 DuPont
9.4 Henkel
9.5 Hitachi High-Tech
9.6 Indium
9.7 Kyocera
9.8 LG Chem
9.9 MacDermid Alpha Electronics Solutions
9.10 Nan Ya Plastics
9.11 Powertech Technology
9.12 Samsung Electro-Mechanics
9.13 Shin-Etsu Chemical
9.14 Sumitomo Bakelite
9.15 Sumitomo Chemical
9.16 Tanaka Holdings
9.17 Texas Instruments
9.18 Toppan Printing
9.19 Toray Industries
9.20 VeriSilicon
