Report Content
Chapter 1 Methodology & Scope
1.1 Market scope & definitions
1.2 Base estimates & calculations
1.3 Forecast calculations
1.4 Data sources
1.4.1 Primary
1.4.2 Secondary
1.4.2.1 Paid sources
1.4.2.2 Public sources
Chapter 2 Executive Summary
2.1 Industry synopsis, 2021-2032
Chapter 3 Industry Insights
3.1 Industry ecosystem analysis
3.1.1 Factor affecting the value chain
3.1.2 Profit margin analysis
3.1.3 Disruptions
3.1.4 Future outlook
3.1.5 Manufacturers
3.1.6 Distributors
3.2 Supplier landscape
3.3 Profit margin analysis
3.4 Key news & initiatives
3.5 Regulatory landscape
3.6 Impact forces
3.6.1 Growth drivers
3.6.1.1. Expansion of 112 G PAM4 connectivity into enterprise networks
3.6.1.2 Increased investment in modern communication networks
3.6.1.3 Increased demand for reliable connectivity solutions.
3.6.1.4. Adoption in V2 X and ADAS technologies.
3.6.1.5 Need for high-performance, rugged connectors
3.6.2 Industry pitfalls & challenges
3.6.2.1 Advanced designs require specialized expertise and resources.
3.6.2.2 Intense competition leads to pricing pressures.
3.7 Growth potential analysis
3.8 Porter’s analysis
3.9 PESTEL analysis
Chapter 4 Competitive Landscape, 2023
4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix
Chapter 5 Market Estimates & Forecast, By Product Type, 2021-2032 (USD Billion)
5.1 Key trends
5.2 BNC connectors
5.3 SMA connectors
5.4 MCX/MMCX connectors
5.5 N-Type connectors
5.6 TNC connectors
5.7 F-Type connectors
5.8 UHF connectors
5.9 QMA connectors
5.10 Others (e.g., SMB, SMC, SMP)
Chapter 6 Market Estimates & Forecast, By Frequency Range, 2021-2032 (USD Billion)
6.1 Key trends
6.2 Low frequency (< 1 GHz)
6.3 Medium frequency (1-6 GHz)
6.4 High frequency (> 6 GHz)
Chapter 7 Market Estimates & Forecast, By Mounting Type, 2021-2032 (USD Billion)
7.1 Key trends
7.2 Edge mount
7.3 Through hole
7.4 Panel mount
7.5 PCB mount
7.6 Others
Chapter 8 Market Estimates & Forecast, By Material, 2021-2032 (USD Billion)
8.1 Key trends
8.2 Brass
8.3 Beryllium copper
8.4 Stainless steel
8.5 Aluminum
8.6 Others
Chapter 9 Market Estimates & Forecast, By Plating, 2021-2032 (USD Billion)
9.1 Key trends
9.2 Gold
9.3 Silver
9.4 Nickel
9.5 Others
Chapter 10 Market Estimates & Forecast, By Application, 2021-2032 (USD Billion)
10.1 Key trends
10.2 Wireless infrastructure
10.3 Test & measurement equipment
10.4 Satellite communication
10.5 Broadcast equipment
10.6 Antenna systems
10.7 IoT devices
10.8 Medical devices
10.9 Others
Chapter 11 Market Estimates & Forecast, By End-Use Industry, 2021-2032 (USD Billion)
11.1 Key trends
11.2 Telecommunications
11.3 Aerospace & defense
11.4 Consumer electronics
11.5 Automotive
11.6 Industrial
11.7 IT & networking
11.8 Healthcare
11.9 Others
Chapter 12 Market Estimates & Forecast, By Region, 2021-2032 (USD Billion)
12.1 Key trends
12.2 North America
12.2.1 U.S.
12.2.2 Canada
12.3 Europe
12.3.1 UK
12.3.2 Germany
12.3.3 France
12.3.4 Italy
12.3.5 Spain
12.3.6 Russia
12.4 Asia Pacific
12.4.1 China
12.4.2 India
12.4.3 Japan
12.4.4 South Korea
12.4.5 Australia
12.5 Latin America
12.5.1 Brazil
12.5.2 Mexico
12.6 MEA
12.6.1 South Africa
12.6.2 Saudi Arabia
12.6.3 UAE
Chapter 13 Company Profiles
13.1 Amphenol Corporation
13.2 Anritsu Corporation
13.3 AVX Corporation
13.4 Belden Inc.
13.5 Bomar Interconnect Products, Inc.
13.6 Carlisle Interconnect Technologies
13.7 Corning Optical Communications
13.8 Delta Electronics, Inc.
13.9 Digi-Key Electronics
13.10 Hirose Electric Co., Ltd.
13.11 HUBER+SUHNER
13.12 JAE (Japan Aviation Electronics Industry, Ltd.)
13.13 Johanson Technology, Inc.
13.14 L-com Global Connectivity
13.15 Molex, LLC
13.16 Pasternack Enterprises Inc.
13.17 Radiall SA
13.18 RF Industries, Ltd.
13.19 Rosenberger Hochfrequenztechnik GmbH & Co. KG
13.20 Samtec Inc.
13.21 Smiths Interconnect
13.22 TE Connectivity Ltd.
13.23 W.L. Gore & Associates, Inc.
