Report Content
Chapter 1 Methodology & Scope
1.1 Scope & definitions
1.2 Methodology and forecast parameters
1.3 Region-wise COVID-19 impact analysis:
1.3.1 North America
1.3.2 Europe
1.3.3 Asia Pacific
1.3.4 LAMEA
1.4 Data Sources
1.4.1 Secondary
1.4.2 Primary
1.5 Industry Glossary
Chapter 2 Executive Summary
2.1 PCB industry 3600 synopsis, 2018 - 2030
2.2 Business trends
2.3 Regional trends
2.4 Type trends
2.5 Substrate trends
2.6 Application trends
Chapter 3 Printed Circuit Board (PCB) Industry Insights
3.1 Introduction
3.2 Impact analysis of coronavirus COVID-19 pandemic
3.2.1 Global outlook
3.2.2 Impact by region
3.2.2.1 North America
3.2.2.2 Europe
3.2.2.3 Asia Pacific
3.2.2.4 Latin America
3.2.2.5 MEA
3.2.3 Industry value chain
3.2.3.1 Research and development
3.2.3.2 Manufacturing
3.2.3.3 Marketing
3.2.3.4 Supply
3.2.4 Competitive landscape
3.2.4.1 Strategy
3.2.4.2 Distribution channel
3.2.4.3 Business growth
3.3 Impact of Russia-Ukraine War
3.3.1 Response of global enterprises
3.3.2 Region-wise response on the Russia-Ukraine crisis
3.3.2.1 North America
3.3.2.2 Europe
3.3.2.3 Asia Pacific
3.3.2.4 Latin America
3.3.2.5 MEA
3.4 Industry ecosystem analysis
3.4.1 Raw material and component supplier
3.4.2 Manufacturer
3.4.3 Marketing and distribution channel
3.4.4 End-users
3.4.5 Profit margin
3.4.6 Vendor matrix
3.5 Technological and innovation landscape
3.5.1 Surface mount technology (SMT)
3.5.2 Through hole mounting technology
3.5.3 5G technology
3.6 Regulatory landscape
3.6.1 North America
3.6.1.1 The CHIPS act (Program)
3.6.1.2 Semiconductor Industry Association (SIA) act 2020. (Investigation of section 301 act)
3.6.2 Europe
3.6.2.1 European Chip Act 2021
3.6.2.2 Anti-Subsidy regulation
3.6.3 Asia Pacific
3.6.3.1 E-waste Regulations Japan
3.6.3.2 E-Waste Regulations in China
3.6.4 Latin America
3.6.4.1 Latin America UNIDO E-Waste program
3.6.5 MEA
3.6.5.1 Toxic Use Reduction Act (TURA)
3.7 Investment landscape
3.8 Industry impact forces
3.8.1 Growth drivers
3.8.1.1 Rising integration of electronic component in vehicles
3.8.1.2 Increasing demand for printed circuit boards in healthcare wearables
3.8.1.3 Increasing demand for automation machinery & industrial robots in the manufacturing sector
3.8.1.4 Proliferation of PCBs among the smartphone manufacturers
3.8.1.5 Rising investments in 5G technology and telecom infrastructure in developing nations
3.8.2 Industry impact forces
3.8.2.1 Technical issues associated with PCB designing
3.9 Growth potential analysis
3.10 Porter’s analysis
3.10.1 Bargaining power of suppliers
3.10.2 Bargaining power of buyers
3.10.3 The threat of new entrants
3.10.4 The threat of substitutes
3.10.5 Competitive rivalry
3.11 PESTEL analysis
3.11.1 Political
3.11.2 Economic
3.11.3 Social
3.11.4 Technological
3.11.5 Legal
3.11.6 Environmental
Chapter 4 Competitive Landscape, 2021
4.1 Introduction
4.2 Company market share
4.3 Competitive analysis of major market players
4.3.1 Zhen Ding Tech. Group Technology Holding Limited
4.3.2 DSBJ
4.3.3 Unimicron Technology Corporation
4.3.4 TTM Technologies
4.3.5 Tripod Technology
4.3.6 AT&S
4.4 Competitive analysis of innovation leaders, 2021
4.4.1 Fujikura Ltd
4.4.2 NITTO DENKO CORPORATION
4.4.3 NIPPON MEKTRON, LTD.
4.4.4 Würth Elektronik GmbH & Co. KG
4.4.5 Sumitomo Electric Printed Circuits, Inc
4.5 Vendor adoption matrix
Chapter 5 Printed Circuit Board (PCB) Market, By Type
5.1 PCB market share, by type, 2021 & 2028
5.2 Single-sided
5.2.1 Market estimates & forecast, 2018-2030
5.3 Double-sided
5.3.1 Market estimates & forecast, 2018-2030
5.4 Multi-layered
5.4.1 Market estimates & forecast, 2018-2030
5.5 HDI (High Density Interconnect)
5.5.1 Market estimates & forecast, 2018-2030
5.6 Other
5.6.1 Market estimates & forecast, 2018-2030
Chapter 6 Printed Circuit Board (PCB) Market, By Substrate
6.1 PCB market share, by substrate, 2021 & 2028
6.2 Rigid
6.2.1 Market estimates & forecast, 2018-2030
6.3 Flexible
6.3.1 Market estimates & forecast, 2018-2030
6.4 Rigid-flex
6.4.1 Market estimates & forecast, 2018-2030
Chapter 7 Printed Circuit Board (PCB) Market, By Application
7.1 PCB market share, by application, 2021 & 2028
7.2 Consumer electronics
7.2.1 Market estimates & forecast, 2018-2030
7.3 Automotive
7.3.1 Market estimates & forecast, 2018-2030
7.4 Healthcare
7.4.1 Market estimates & forecast, 2018-2030
7.5 IT & Telecom
7.5.1 Market estimates & forecast, 2018-2030
7.6 Industrial
7.6.1 Market estimates & forecast, 2018-2030
7.7 Other
7.7.1 Market estimates & forecast, 2018-2030
Chapter 8 Printed Circuit Board (PCB) Market, By Region
8.1 PCB market share, by region, 2021 & 2028
8.2 North America
8.2.1 Market estimates & forecast, by type, 2018-2030
8.2.2 Market estimates & forecast, by substrate, 2018-2030
8.2.3 Market estimates & forecast, by application, 2018-2030
8.2.4 U.S.
8.2.4.1 Market estimates & forecast, by type, 2018-2030
8.2.4.2 Market estimates & forecast, by substrate, 2018-2030
8.2.4.3 Market estimates & forecast, by application, 2018-2030
8.2.5 Canada
8.2.5.1 Market estimates & forecast, by type, 2018-2030
8.2.5.2 Market estimates & forecast, by substrate, 2018-2030
8.2.5.3 Market estimates & forecast, by application, 2018-2030
8.3 Europe
8.3.1 Market estimates & forecast, by type, 2018-2030
8.3.2 Market estimates & forecast, by substrate, 2018-2030
8.3.3 Market estimates & forecast, by application, 2018-2030
8.3.4 UK
8.3.4.1 Market estimates & forecast, by type, 2018-2030
8.3.4.2 Market estimates & forecast, by substrate, 2018-2030
8.3.4.3 Market estimates & forecast, by application, 2018-2030
8.3.5 Germany
8.3.5.1 Market estimates & forecast, by type, 2018-2030
8.3.5.2 Market estimates & forecast, by substrate, 2018-2030
8.3.5.3 Market estimates & forecast, by application, 2018-2030
8.3.6 France
8.3.6.1 Market estimates & forecast, by type, 2018-2030
8.3.6.2 Market estimates & forecast, by substrate, 2018-2030
8.3.6.3 Market estimates & forecast, by application, 2018-2030
8.3.7 Italy
8.3.7.1 Market estimates & forecast, by type, 2018-2030
8.3.7.2 Market estimates & forecast, by substrate, 2018-2030
8.3.7.3 Market estimates & forecast, by application, 2018-2030
8.3.8 Russia
8.3.8.1 Market estimates & forecast, by type, 2018-2030
8.3.8.2 Market estimates & forecast, by substrate, 2018-2030
8.3.8.3 Market estimates & forecast, by application, 2018-2030
8.4 Asia Pacific
8.4.1 Market estimates & forecast, by type, 2018-2030
8.4.2 Market estimates & forecast, by substrate, 2018-2030
8.4.3 Market estimates & forecast, by application, 2018-2030
8.4.4 China
8.4.4.1 Market estimates & forecast, by type, 2018-2030
8.4.4.2 Market estimates & forecast, by substrate, 2018-2030
8.4.4.3 Market estimates & forecast, by application, 2018-2030
8.4.5 Japan
8.4.5.1 Market estimates & forecast, by type, 2018-2030
8.4.5.2 Market estimates & forecast, by substrate, 2018-2030
8.4.5.3 Market estimates & forecast, by application, 2018-2030
8.4.6 India
8.4.6.1 Market estimates & forecast, by type, 2018-2030
8.4.6.2 Market estimates & forecast, by substrate, 2018-2030
8.4.6.3 Market estimates & forecast, by application, 2018-2030
8.4.7 South Korea
8.4.7.1 Market estimates & forecast, by type, 2018-2030
8.4.7.2 Market estimates & forecast, by substrate, 2018-2030
8.4.7.3 Market estimates & forecast, by application, 2018-2030
8.4.8 Taiwan
8.4.8.1 Market estimates & forecast, by type, 2018-2030
8.4.8.2 Market estimates & forecast, by substrate, 2018-2030
8.4.8.3 Market estimates & forecast, by application, 2018-2030
8.4.9 Thailand
8.4.9.1 Market estimates & forecast, by type, 2018-2030
8.4.9.2 Market estimates & forecast, by substrate, 2018-2030
8.4.9.3 Market estimates & forecast, by application, 2018-2030
8.5 LAMEA
8.5.1 Market estimates & forecast, by type, 2018-2030
8.5.2 Market estimates & forecast, by substrate, 2018-2030
8.5.3 Market estimates & forecast, by application, 2018-2030
8.5.4 Brazil
8.5.4.1 Market estimates & forecast, by type, 2018-2030
8.5.4.2 Market estimates & forecast, by substrate, 2018-2030
8.5.4.3 Market estimates & forecast, by application, 2018-2030
8.5.5 Mexico
8.5.5.1 Market estimates & forecast, by type, 2018-2030
8.5.5.2 Market estimates & forecast, by substrate, 2018-2030
8.5.5.3 Market estimates & forecast, by application, 2018-2030
8.5.6 GCC
8.5.6.1 Market estimates & forecast, by type, 2018-2030
8.5.6.2 Market estimates & forecast, by substrate, 2018-2030
8.5.6.3 Market estimates & forecast, by application, 2018-2030
Chapter 9 Company Profiles
9.1 Advanced Circuitry International, Inc
9.1.1 Business overview
9.1.2 Financial data
9.1.3 Product landscape
9.1.4 Go-to-market strategy
9.1.5 SWOT analysis
9.2 Advanced Circuits
9.2.1 Business overview
9.2.2 Financial data
9.2.3 Product landscape
9.2.4 Go-to-market strategy
9.2.5 SWOT analysis
9.3 A-Flex
9.3.1 Business overview
9.3.2 Financial data
9.3.3 Product landscape
9.3.4 Go-to-market strategy
9.3.5 SWOT analysis
9.4 American Standard Circuits
9.4.1 Business overview
9.4.2 Financial data
9.4.3 Product landscape
9.4.4 Go-to-market strategy
9.4.5 SWOT analysis
9.5 Amitron Corp.
9.5.1 Business overview
9.5.2 Financial data
9.5.3 Product landscape
9.5.4 Go-To-market strategy
9.5.5 SWOT analysis
9.6 AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
9.6.1 Business overview
9.6.2 Financial data
9.6.3 Product landscape
9.6.4 Go-to-Market strategy
9.6.5 SWOT analysis
9.7 Becker & Muller Schaltungsdruck GmbH
9.7.1 Business overview
9.7.2 Financial data
9.7.3 Product landscape
9.7.4 Go-to-market strategy
9.7.5 SWOT analysis
9.8 Eltek Ltd.
9.8.1 Business overview
9.8.2 Financial data
9.8.3 Product landscape
9.8.4 Go-to-market strategy
9.8.5 SWOT analysis
9.9 Epec, LLC
9.9.1 Business overview
9.9.2 Financial data
9.9.3 Product landscape
9.9.4 Go-to-market strategy
9.9.5 SWOT analysis
9.10 Flex PCB
9.10.1 Business overview
9.10.2 Financial data
9.10.3 Product landscape
9.10.4 Go-to-market strategy
9.10.5 SWOT analysis
9.11 Fujikura Limited
9.11.1 Business overview
9.11.2 Financial data
9.11.3 Product landscape
9.11.4 Go-to-market strategy
9.11.5 SWOT analysis
9.12 Hitech Circuits Co., Ltd
9.12.1 Business overview
9.12.2 Financial data
9.12.3 Product landscape
9.12.4 Go-to-market strategy
9.12.5 SWOT analysis
9.13 Kinwong Electronic Corporation Limited
9.13.1 Business overview
9.13.2 Financial data
9.13.3 Product landscape
9.13.4 Go-to-market strategy
9.13.5 SWOT analysis
9.14 MultiTech Electron HK Limited.
9.14.1 Business overview
9.14.2 Financial data
9.14.3 Product landscape
9.14.4 Go-to-market-strategy
9.14.5 SWOT analysis
9.15 NITTO DENKO CORPORATION
9.15.1 Business overview
9.15.2 Financial data
9.15.3 Product landscape
9.15.4 Go-to-market strategy
9.15.5 SWOT analysis
9.16 Rayming Technology
9.16.1 Business overview
9.16.2 Financial data
9.16.3 Product landscape
9.16.4 Go-to-market strategy
9.16.5 SWOT analysis
9.17 Sumitomo Electric Printed Circuits, Inc.
9.17.1 Business overview
9.17.2 Financial data
9.17.3 Product landscape
9.17.4 Go-to-market strategy
9.17.5 SWOT analysis
9.18 Unimicron Technology (Shenzhen) Corp.
9.18.1 Business overview
9.18.2 Financial data
9.18.3 Product landscape
9.18.4 Go-to-market strategy
9.18.5 SWOT analysis
9.19 TTM Technologies Incorporated
9.19.1 Business overview
9.19.2 Financial data
9.19.3 Product landscape
9.19.4 Go-to-market strategy
9.19.5 SWOT analysis
9.20 Wurth Elektronik GmbH & Co. KG.
9.20.1 Business overview
9.20.2 Financial data
9.20.3 Product landscape
9.20.4 Go-to-market strategy
9.20.5 SWOT analysis
