Report Content
Chapter 1 Methodology & Scope
1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data sources
1.4.1 Primary
1.4.2 Secondary
1.4.2.1 Paid sources
1.4.2.2 Public sources
Chapter 2 Executive Summary
2.1 Industry 360º synopsis, 2021 - 2032
Chapter 3 Industry Insights
3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Profit margin analysis
3.4 Technology & innovation landscape
3.5 Patent analysis
3.6 Key news and initiatives
3.7 Regulatory landscape
3.8 Impact forces
3.8.1 Growth drivers
3.8.1.1 Miniaturization of electronic devices
3.8.1.2 Advancements in manufacturing technologies
3.8.1.3 Growing demand in automotive industry
3.8.1.4 Environmental and regulatory benefits
3.8.1.5 Increasing adoption in medical devices
3.8.2 Industry pitfalls & challenges
3.8.2.1 High initial manufacturing costs
3.8.2.2 Design complexity and expertise requirements
3.9 Growth potential analysis
3.10 Porter’s analysis
3.10.1 Supplier power
3.10.2 Buyer power
3.10.3 Threat of new entrants
3.10.4 Threat of substitutes
3.10.5 Industry rivalry
3.11 PESTEL analysis
Chapter 4 Competitive Landscape, 2023
4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix
Chapter 5 Market Estimates & Forecast, By Process Segment, 2021 - 2032 (USD million)
5.1 Key trends
5.2 Laser Direct Structuring
5.3 2-Shot Molding
5.4 Film Techniques
Chapter 6 Market Estimates & Forecast, By Product Type, 2021 - 2032 (USD million)
6.1 Key trends
6.2 Antennae & Connectivity Modules
6.3 Connectors & Switches
6.4 Sensors
6.5 Lighting
6.6 Others
Chapter 7 Market Estimates & Forecast, By Industry Vertical, 2021 - 2032 (USD million)
7.1 Key trends
7.2 Telecommunications
7.3 Consumer Electronics
7.4 BFSI
7.5 Military & Aerospace
7.6 Industrial
7.7 Healthcare
7.8 Automotive
7.9 Others
Chapter 8 Market Estimates & Forecast, By Region, 2021 - 2032 (USD million)
8.1 Key trends
8.2 North America
8.2.1 U.S.
8.2.2 Canada
8.3 Europe
8.3.1 UK
8.3.2 Germany
8.3.3 France
8.3.4 Italy
8.3.5 Spain
8.3.6 Rest of Europe
8.4 Asia Pacific
8.4.1 China
8.4.2 India
8.4.3 Japan
8.4.4 South Korea
8.4.5 ANZ
8.4.6 Rest of Asia Pacific
8.5 Latin America
8.5.1 Brazil
8.5.2 Mexico
8.5.3 Rest of Latin America
8.6 MEA
8.6.1 UAE
8.6.2 South Africa
8.6.3 Saudi Arabia
8.6.4 Rest of MEA
Chapter 9 Company Profiles
9.1 TE Connectivity
9.2 SelectConnect Technologies
9.3 Suzhou Cicor Technology Co., Ltd
9.4 LPKF Laser & Electronics AG
9.5 HARTING Technology Group
9.6 MacDermid Enthone Electronics Solutions
9.7 TEPROSA GmbH
9.8 Hartmann Codier GmbH
9.9 2E mechatronic GmbH & Co. KG
9.10 Hughes Circuits Inc.
9.11 MID Solutions GmbH
9.12 Mitsubishi Engineering-Plastics Corporation
9.13 LaserMicronics GmbH
9.14 AKKA Technologies
9.15 SMK Corporation
9.16 Cicor Group
9.17 Neotech AMT GmbH
9.18 S2P
9.19 GALTRONICS
9.20 Molex LLC
9.21 RTP Company
9.22 BASF
9.23 EMS-Chemie AG
9.24 Ensinger
9.25 Zeon Corporation
