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Interposer and Fan-out WLP Market - By Packaging Component (Interposer, FOWLP), By Application, By Packaging Type (2.5D, 3D), By End-User (Consumer Electronics, Telecommunication, Industrial, Automotive, Military & Aerospace) & Forecast, 2024 - 2032

  • Report ID: GMI8177
  • Published Date: Feb 2024
  • Report Format: PDF

Report Content

Chapter 1   Methodology & Scope

1.1    Market scope & definitions

1.2    Base estimates & calculations

1.3    Forecast calculations

1.4    Data sources

1.4.1    Primary

1.4.2    Secondary

1.4.2.1   Paid sources

1.4.2.2   Public sources

Chapter 2   Executive Summary

2.1    Industry 360° synopsis, 2018 - 2032

Chapter 3   Industry Insights

3.1    Industry ecosystem analysis

3.2    Profit margin analysis

3.3    Technology & innovation landscape

3.4    Patent analysis

3.5    Key news & initiatives

3.6    Regulatory landscape

3.7    Impact forces

3.7.1    Growth drivers

3.7.1.1   Increasing demand for miniaturization in electronic devices drives growth

3.7.1.2   Growing adoption of advanced packaging solutions in smartphones and wearables

3.7.1.3   Increasing complexity of semiconductor designs boosts demand for interposer and fan-out WLP

3.7.1.4   Increasing use in data centers for improved performance and power efficiency

                                 3.7.1.5. Growing focus on 5 G technology stimulates demand for advanced packaging solutions

3.7.2    Industry pitfalls & challenges

3.7.2.1   Thermal management

3.7.2.2   Standards and compatibility challenges

3.8    Growth potential analysis

3.9    Porter’s analysis

3.9.1    Supplier power

3.9.2    Buyer power

3.9.3    Threat of new entrants

3.9.4    Threat of substitutes

3.9.5    Industry rivalry

3.10    PESTEL analysis

Chapter 4   Competitive Landscape, 2023

4.1    Introduction

4.2    Company market share analysis

4.3    Competitive positioning matrix

4.4    Strategic outlook matrix

Chapter 5   Market Estimates & Forecast, By Packaging Component, 2018 - 2032 (USD Million)

5.1    Key trends

5.2    Interposer

5.3    FOWLP

Chapter 6   Market Estimates & Forecast, By Application, 2018 - 2032 (USD Million)

6.1    Key trends

6.2    MEMS or sensors

6.3    Imaging & optoelectronics

6.4    Memory

6.5    Logic ICs

6.6    LEDs

6.7    Others

Chapter 7   Market Estimates & Forecast, By Packaging Type, 2018 - 2032 (USD Million)

7.1    Key trends

7.2    2.5D

7.3    3D

Chapter 8   Market Estimates & Forecast, By End-User, 2018 - 2032 (USD Million)

8.1    Key trends

8.2    Consumer electronics

8.3    Automotive

8.4    Industrial sector

8.5    Telecommunications

8.6    Military & aerospace

8.7    Others

Chapter 9   Market Estimates & Forecast, By Region, 2018 - 2032 (USD Million)

9.1    Key trends

9.2    North America

9.2.1    U.S.

9.2.2    Canada

9.3    Europe

9.3.1    UK

9.3.2    Germany

9.3.3    France

9.3.4    Italy

9.3.5    Spain

9.3.6    Russia

9.3.7    Rest of Europe

9.4    Asia Pacific

9.4.1    China

9.4.2    India

9.4.3    Japan

9.4.4    South Korea

9.4.5    ANZ

9.4.6    Rest of Asia Pacific

9.5    Latin America

9.5.1    Brazil

9.5.2    Mexico

9.5.3    Rest of Latin America

9.6    MEA

9.6.1    UAE

9.6.2    Saudi Arabia

9.6.3    South Africa

9.6.4    Rest of MEA

Chapter 10   Company Profiles

10.1    ALLVIA, Inc.

10.2    AMETEK Inc.

10.3    Amkor Technology

10.4    ASE Technology Holding Co., Ltd.

10.5    ASTI Holdings Limited

10.6    Broadcom

10.7    Infineon Technologies AG

10.8    Intel Corporation

10.9    LAM RESEARCH CORPORATION

10.10    Murata Manufacturing Co., Ltd.

10.11    Powertech Technology Inc.

10.12    Qualcomm Technologies, Inc.

10.13    SAMSUNG

10.14    Siliconware Precision Industries Co.

10.15    STMicroelectronics

10.16    Taiwan Semiconductor Manufacturing Company Limited

10.17    Texas Instruments Incorporated

10.18    TOSHIBA CORPORATION

10.19    United Microelectronics Corporation
 

Authors: Suraj Gujar , Sandeep Ugale

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Premium Report Details

  • Base Year: 2023
  • Companies covered: 19
  • Tables & Figures: 355
  • Countries covered: 22
  • Pages: 250
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