Report Content
Chapter 1 Methodology & Scope
1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data Sources
1.4.1 Primary
1.4.2 Secondary
1.4.2.1 Paid sources
1.4.2.2 Public sources
Chapter 2 Executive Summary
2.1 Fan-out wafer level packaging market 3600 synopsis, 2018 - 2032
2.2 Business trends
2.2.1 Total Addressable Market, 2023 - 2032
2.3 Regional trends
2.4 Process type trends
2.5 Business model trends
2.6 Application trends
Chapter 3 Fan-Out Wafer Level Packaging Market Insights
3.1 Impact on COVID-19
3.2 Russia-Ukraine war impact
3.3 Industry ecosystem analysis
3.4 Vendor matrix
3.5 Profit margin analysis
3.6 Technology & innovation landscape
3.7 Patent analysis
3.8 Key news and initiatives
3.9 Regulatory landscape
3.10 Impact forces
3.10.1 Growth drivers
3.10.1.1 Growing penetration of miniaturized semiconductor components in consumer electronics sector
3.10.1.2 Proliferation of 5G technology in developing nations
3.10.1.3 Increasing adoption of IoT and AI technologies in automotive sector
3.10.1.4 Continuous R&D for enhancing advanced packaging technologies
3.10.1.5 Rising demand for heterogeneous integration of wafer components
3.10.2 Industry pitfalls & challenges
3.10.2.1 High volume production with design complexity
3.11 Growth potential analysis
3.12 Porter’s analysis
3.13 PESTEL analysis
Chapter 4 Competitive Landscape, 2022
4.1 Introduction
4.2 Company market share, 2022
4.3 Competitive analysis of major market players, 2022
4.3.1 Taiwan Semiconductor Manufacturing Company (TSMC) Limited
4.3.2 ASE Technology Holding Co., Ltd
4.3.3 JCET Group Co., Ltd.
4.3.4 Siliconware Precision Industries Co., Ltd.
4.3.5 Amkor Technology
4.3.6 Powertech Technology Inc.
4.3.7 Nepes Corporation
4.4 Competitive positioning matrix, 2022
4.5 Strategic outlook matrix, 2022
Chapter 5 Fan-Out Wafer Level Packaging Market Estimates and Forecast, By Process Type (USD Million)
5.1 Key trends, by process type
5.2 Standard density packaging
5.3 High density packaging
5.4 Bumping
Chapter 6 Fan-Out Wafer Level Packaging Market Estimates and Forecast, By Business Model (USD Million)
6.1 Key trends, by business model
6.2 OSAT
6.3 Foundry
6.4 IDM
Chapter 7 Fan-Out Wafer Level Packaging Market Estimates and Forecast, By Application (USD Million)
7.1 Key trends, by application
7.2 Consumer electronics
7.3 Automotive
7.4 Industrial
7.5 Healthcare
7.6 Aerospace & Defense
7.7 IT & Telecommunication
7.8 Others
Chapter 8 Fan-out wafer level packaging Market Estimates and Forecast, By Region (USD Million)
8.1 Key trends, by region
8.2 North America
8.2.1 U.S.
8.2.2 Canada
8.3 Europe
8.3.1 UK
8.3.2 Germany
8.3.3 France
8.3.4 Italy
8.3.5 Netherlands
8.4 Asia Pacific
8.4.1 China
8.4.2 Japan
8.4.3 South Korea
8.4.4 Taiwan
8.5 LAMEA
8.5.1 Brazil
8.5.2 Mexico
8.5.3 Israel
Chapter 9 Company Profiles
9.1 Amkor Technology
9.2 ASE Technology Holding Co., Ltd
9.3 ChipMOS Technologies Inc.
9.4 Deca Technologies
9.5 GlobalFoundries Inc.
9.6 JCET Group Co., Ltd.
9.7 Nepes Corporation
9.8 Powertech Technology Inc.
9.9 Siliconware Precision Industries Co., Ltd.
9.10 Taiwan Semiconductor Manufacturing Company Limited
9.11 Unisem Group
9.12 Tongfu Mikcroelectronics Co. Ltd
9.13 UTAC
