Report Content
Chapter 1 Methodology & Scope
1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data sources
1.4.1 Primary
1.4.2 Secondary
1.4.2.1 Paid sources
1.4.2.2 Public sources
Chapter 2 Executive Summary
2.1 Industry 360º synopsis, 2021-2032
Chapter 3 Industry Insights
3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Profit margin analysis
3.4 Technology & innovation landscape
3.5 Patent analysis
3.6 Key news and initiatives
3.7 Regulatory landscape
3.8 Impact forces
3.8.1 Growth drivers
3.8.1.1 Rising demand for advanced semiconductor devices
3.8.1.2 Growth in electric vehicles (EVs) market
3.8.1.3 Advancements in photonics and optoelectronics
3.8.1.4 Growing adoption of compound semiconductors
3.8.1.5 Increasing investments in semiconductor manufacturing
3.8.2 Industry pitfalls & challenges
3.8.2.1 High manufacturing costs
3.8.2.2 Technological challenges and complexity
3.9 Growth potential analysis
3.10 Porter’s analysis
3.10.1 Supplier power
3.10.2 Buyer power
3.10.3 Threat of new entrants
3.10.4 Threat of substitutes
3.10.5 Industry rivalry
3.11 PESTEL analysis
Chapter 4 Competitive Landscape, 2023
4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix
Chapter 5 Market Estimates & Forecast, By Type of Wafer, 2021-2032 (USD Million & Units)
5.1 Key trends
5.2 Silicon-based epi wafers
5.3 Gallium arsenide (GaAs) epi wafers
5.4 Silicon carbide (SiC) epi wafers
5.5 Gallium nitride (GaN) epi wafers
5.6 Other materials
Chapter 6 Market Estimates & Forecast, By Wafer Size, 2021-2032 (USD Million & Units)
6.1 Key trends
6.2 2-inch wafers
6.3 4-inch wafers
6.4 6-inch wafers
6.5 8-inch wafers
6.6 12-inch wafers
6.7 Other sizes
Chapter 7 Market Estimates & Forecast, By Application, 2021-2032 (USD Million & Units)
7.1 Key trends
7.2 Consumer electronics
7.3 Automotive
7.4 Industrial
7.5 Telecommunications
7.6 Healthcare
7.7 Defense and aerospace
7.8 Others
Chapter 8 Market Estimates & Forecast, By Deposition Method, 2021-2032 (USD Million & Units)
8.1 Key trends
8.2 Chemical vapor deposition (CVD)
8.3 Molecular beam epitaxy (MBE)
8.4 Metalorganic chemical vapor deposition (MOCVD)
8.5 Liquid phase epitaxy (LPE)
8.6 Other deposition techniques
Chapter 9 Market Estimates & Forecast, By End Use Industry, 2021-2032 (USD Million & Units)
9.1 Key trends
9.2 Semiconductor manufacturing
9.3 Optoelectronics
9.4 Power electronics
9.5 Photovoltaic cells
9.6 Others
Chapter 10 Market Estimates & Forecast, By Region, 2021-2032 (USD Million & Units)
10.1 Key trends
10.2 North America
10.2.1 U.S.
10.2.2 Canada
10.3 Europe
10.3.1 UK
10.3.2 Germany
10.3.3 France
10.3.4 Italy
10.3.5 Spain
10.3.6 Rest of Europe
10.4 Asia Pacific
10.4.1 China
10.4.2 India
10.4.3 Japan
10.4.4 South Korea
10.4.5 ANZ
10.4.6 Rest of Asia Pacific
10.5 Latin America
10.5.1 Brazil
10.5.2 Mexico
10.5.3 Rest of Latin America
10.6 MEA
10.6.1 UAE
10.6.2 South Africa
10.6.3 Saudi Arabia
10.6.4 Rest of MEA
Chapter 11 Company Profiles
11.1 Advanced Wireless Semiconductor Company (AWSC)
11.2 AXT, Inc.
11.3 Cree, Inc. (Now Wolfspeed, Inc.)
11.4 Epistar Corporation
11.5 Freiberger Compound Materials GmbH
11.6 GlobalWafers Co., Ltd.
11.7 IQE plc
11.8 NanoSystec GmbH
11.9 Nichia Corporation
11.10 Saint-Gobain
11.11 Shin-Etsu Chemical Co., Ltd.
11.12 Siltronic AG
11.13 Sino-American Silicon Products Inc. (SAS)
11.14 SK Siltron
11.15 Soitec
11.16 SUMCO Corporation
11.17 Sumitomo Electric Industries, Ltd.
11.18 Topsil Semiconductor Materials A/S
11.19 WaferPro
11.20 Wafer World, Inc.
11.21 Xiamen Powerway Advanced Material Co., Ltd.
