Report Content
Chapter 1 Methodology & Scope
1.1 Market scope & definition
1.2 Base estimates & calculations
1.3 Forecast calculation
1.4 Data sources
1.4.1 Primary
1.4.2 Secondary
1.4.2.1 Paid sources
1.4.2.2 Public sources
Chapter 2 Executive Summary
2.1 Industry 360º synopsis, 2021-2032
Chapter 3 Industry Insights
3.1 Industry ecosystem analysis
3.2 Vendor matrix
3.3 Profit margin analysis
3.4 Technology & innovation landscape
3.5 Patent analysis
3.6 Key news and initiatives
3.7 Regulatory landscape
3.8 Impact forces
3.8.1 Growth drivers
3.8.1.1 Increased demand for high-performance and miniaturized devices
3.8.1.2 Growing adoption in the automotive industry
3.8.1.3 Increased investment in advanced manufacturing technologies
3.8.1.4 Rising demand for data centers and cloud computing
3.8.1.5 Growing importance of power efficiency and thermal management
3.8.2 Industry pitfalls & challenges
3.8.2.1 Technical complexities and yield issues
3.8.2.2 Supply chain disruptions and material shortages
3.9 Growth potential analysis
3.10 Porter’s analysis
3.10.1 Supplier power
3.10.2 Buyer power
3.10.3 Threat of new entrants
3.10.4 Threat of substitutes
3.10.5 Industry rivalry
3.11 PESTEL analysis
Chapter 4 Competitive Landscape, 2023
4.1 Introduction
4.2 Company market share analysis
4.3 Competitive positioning matrix
4.4 Strategic outlook matrix
Chapter 5 Market Estimates & Forecast, By Technology, 2021-2032 (USD Million)
5.1 Key trends
5.2 3D Through silicon via
5.3 3D Package on package
5.4 3D Wafer-Level Chip-Scale Packaging (WL-CSP)
5.5 3D System-on-Chip (3D SoC)
5.6 3D Integrated Circuit (3D IC)
Chapter 6 Market Estimates & Forecast, By Material, 2021-2032 (USD Million)
6.1 Key trends
6.2 Organic substrates
6.3 Bonding wires
6.4 Lead frames
6.5 Ceramic packages
6.6 Encapsulation resins
6.7 Others
Chapter 7 Market Estimates & Forecast, By End-use Industry, 2021-2032 (USD Million)
7.1 Key trends
7.2 Consumer electronics
7.3 Automotive
7.4 Healthcare
7.5 IT & telecommunications
7.6 Industrial
7.7 Aerospace and defense
7.8 Others
Chapter 8 Market Estimates & Forecast, By Region, 2021-2032 (USD Million)
8.1 Key trends
8.2 North America
8.2.1 U.S.
8.2.2 Canada
8.3 Europe
8.3.1 UK
8.3.2 Germany
8.3.3 France
8.3.4 Italy
8.3.5 Spain
8.3.6 Rest of Europe
8.4 Asia Pacific
8.4.1 China
8.4.2 India
8.4.3 Japan
8.4.4 South Korea
8.4.5 ANZ
8.4.6 Rest of Asia Pacific
8.5 Latin America
8.5.1 Brazil
8.5.2 Mexico
8.5.3 Rest of Latin America
8.6 MEA
8.6.1 UAE
8.6.2 South Africa
8.6.3 Saudi Arabia
8.6.4 Rest of MEA
Chapter 9 Company Profiles
9.1 Advanced Semiconductor Engineering, Inc.
9.2 Amkor Technology, Inc.
9.3 ASE Group
9.4 Fujitsu Limited
9.5 Intel Corporation
9.6 International Business Machines Corporation (IBM)
9.7 JCET Group Co., Ltd.
9.8 Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET)
9.9 Micron Technology, Inc.
9.10 Nanya Technology Corporation
9.11 Powertech Technology Inc.
9.12 Qualcomm Technologies, Inc.
9.13 Samsung Electronics Co., Ltd.
9.14 Siliconware Precision Industries Co., Ltd. (SPIL)
9.15 SK Hynix Inc.
9.16 STMicroelectronics N.V.
9.17 SUSS MicroTec AG
9.18 Taiwan Semiconductor Manufacturing Company, Ltd. (TSMC)
9.19 Texas Instruments Incorporated
9.20 Tongfu Microelectronics Co., Ltd.
9.21 United Microelectronics Corporation (UMC)
9.22 UTAC Holdings Ltd.
