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Based on type, the thermally conductive filler dispersants market is segmented as metal-based fillers, ceramic-based fillers, carbon-based fillers, other specialty fillers. Metal based fillers held a majority industry value of USD 68.1 million in 2022. Metal-based fillers, such as silver, copper, aluminum, and other metal particles, significantly improve the thermal conductivity of polymer matrices. This is a primary driver for their use in applications requiring effective heat dissipation.
Based on application, the thermally conductive filler dispersants market is segmented as screen printing, dispensing, extrusion, spray coating, syringe dispensing, others. Screen printing box held a dominant industry share of around 36% in 2022. Screen printing is used to create printed electronic components with integrated thermally conductive filler dispersants, enabling precise placement and improved heat transfer.
Based on end-use the thermally conductive filler dispersants market is segmented as electronics and electrical, automotive, aerospace and defense, industrial machinery, telecommunications, healthcare and medical devices, consumer goods, others. Electronics and electricals segment is anticipated to grow at 7.2% CAGR by 2032. As electronic devices become smaller and more powerful, the need for effective thermal management becomes even more critical to prevent thermal-related failures.
U.S. dominated the North American region with majority thermally conductive filler dispersants market share and a revenue of USD 285 million in 2022 and is anticipated to expand at a significant pace from 2023-2032. North America is a hub for electronics and semiconductor manufacturing. With the increasing miniaturization and power density of electronic devices, efficient thermal management is essential.
Global market for thermally conductive filler dispersants was valued at around USD 285 million in 2023 and is estimated to reach USD 719 million by the end of 2032.
Henkel AG & Co. KGaA, Dow Inc., 3M Company, Shin-Etsu Chemical Co., Ltd., Momentive Performance Materials Inc., Saint-Gobain Performance Plastics, Indium Corporation, A. Schulman (LyondellBasell), Creative Materials Inc., Henan Sanyuan New Materials Co., Ltd., Masterbond, DKSH Group, Laird Performance Materials, Nusil Technology LLC, AI Technology, Inc. among others.
U.S. market size was USD 285 million in 2022 and will expand at a significant pace through 2032 as the nation is a hub for electronics and semiconductor manufacturing.
Electronics and electricals segment will record around 7.2% CAGR from 2023 to 2032. As electronic devices become smaller and more powerful, the need for effective thermal management becomes even more critical to prevent thermal-related failures.