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Based on component, the market is divided into Integrated Circuit (ICS), processors & controllers, power management, and memory. The processors & controllers’ segment is expected to reach over USD 1 billion by 2032.
Based on manufacturing technique, the radiation hardened electronics market is segmented into Radiation Hardening by Design (RHBD) and Radiation Hardening by Process (RHBP). The RHBP segment is expected to register a CAGR of over 5.5% during the forecast period.
Asia Pacific dominated the radiation hardened electronics market in 2023 with over 30% of the total revenue share. The Asia Pacific market for radiation-hardened electronics is expected to rise owing to rising space exploration programs and satellite deployments by countries including China and India. The need for radiation-resistant electronic components is also fueled by the growing defense & aerospace industry as well as increased spending on vital infrastructure. Asia Pacific is a potential hub for this business, driven by government initiatives and developments in semiconductor technologies.
The radiation hardened electronics industry was valued at over USD 1.5 billion in 2023 and is estimated to register a CAGR of over 5% between 2024 & 2032, driven by increasing space exploration missions and satellite deployments.
RHBP manufacturing technique segment held a decent market share in 2023 and is expected to register a CAGR of over 5.5% through 2032, as it provides a cost-effective solution for enhancing the radiation resistance of electronics.
Asia Pacific radiation hardened electronics industry held a revenue share of over 30% in 2023 and will show strong growth trends through 2032, owing to rising space exploration programs and satellite deployments by countries including China and India.
Honeywell International Inc., BAE Systems, Microchip Technology Inc., Renesas Electronics Corporation, Advanced Micro Devices, Inc. are some of the major industry contenders.