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Based on type, the market is segmented into wafer slicing equipment, wafer lapping & polishing equipment, wafer cleaning equipment, wafer inspection equipment, wafer testing equipment, and wafer dicing equipment. The wafer cleaning equipment segment led the global market with a share of over 25% in 2022.
Based on the wafer size, the market is divided into 100-200m, 200- 300mm, and above 300mm. The above 300mm is further categorized into products (hardware, software) and services. The above 300mm segment is anticipated to register a CAGR of over 5% through 2032.
Asia Pacific dominated the global market with a share of over 80% in 2022. Asia Pacific is positioned as a major growth hub owing to the rising electronics demand and significant expenditure in the infrastructure supporting semiconductor manufacturing. The industry has experienced significant growth with the support of countries, such as China, Taiwan, and South Korea, which have fostered technological developments and attracted major investments. The region's dominance in the wafer manufacturing equipment market is also attributed to a strong supply chain, a trained workforce, and supportive government regulations.