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Thin Wafer Processing & Dicing Equipment Market Size
- Report ID: GMI11811
- Published Date: Oct 2024
- Report Format: PDF
Thin Wafer Processing & Dicing Equipment Market Size
The global thin wafer processing & dicing equipment market was valued at USD 710.3 million in 2023 and is estimated to grow at a CAGR of over 7% from 2024 to 2032.The market is driven by the increasing demand for miniaturized and high-performance electronic devices across industries such as consumer electronics, automotive, and telecommunications.
The rise of 5G, electric vehicles, and advanced materials like silicon carbide (SiC) and gallium nitride (GaN) has intensified the need for precision wafer processing to ensure efficient production of microchips and sensors. Innovations in laser-based dicing technologies, which offer higher speed, accuracy, and cost savings, further boost market growth by meeting the requirements for thinner and more durable semiconductor components. For instance, in March 2023, Lidrotec secured USD 1 million in follow-on funding and received the title of Company of the Year at the Luminate 2022 Finals. The company’s innovative laser technology for wafer dicing effectively responds to the increasing demands of the thin wafer processing and dicing equipment market.
| Report Attribute | Details |
|---|---|
| Base Year: | 2023 |
| Thin Wafer Processing & Dicing Equipment Market Size in 2023: | USD 710.3 Million |
| Forecast Period: | 2024 - 2032 |
| Forecast Period 2024 - 2032 CAGR: | 7% |
| 2032 Value Projection: | USD 1.25 Billion |
| Historical Data for: | 2021 - 2023 |
| No. of Pages: | 240 |
| Tables, Charts & Figures: | 390 |
| Segments covered: | Equipment Type, Wafer Size, Application, End-use Industry |
| Growth Drivers: |
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Frequently Asked Questions (FAQ) :
Thin Wafer Processing & Dicing Equipment Market Scope
