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Thin Wafer Market Size

  • Report ID: GMI5007
  • Published Date: Mar 2021
  • Report Format: PDF

Thin Wafer Market Size

Thin Wafer Market size was valued at over USD 6.5 billion in 2020 and is estimated to grow at a CAGR of more than 6% from 2021 to 2027.

 

The proliferation of compact and miniaturized devices such as smart wearables and smartphones, among others has propelled the demand for thin wafer technology. Integrated device manufactures are inclined toward the adoption of customization functionality with high-quality resistor, inductor, and capacitor on highly resistive silicon material. This will accelerate miniaturization property in high-performance computing devices. Rising mitigation toward new node technologies with reduced size will also drive the thin wafer market potential for thin wafer manufacturers.
 

Thin wafers are semiconductor wafers that have a diameter less than the standard thickness, i.e., 250 μm. The thickness and size of the wafer can vary depending on the specific application of the semiconductor devices.
 

The COVID-19 outbreak has severely affected the thin wafer market due to disruption in the trade supply chain. The disruption resulted in the shortage of foundry capacities in early 2020. The demand spike for semiconductor components and disruption in international trade have led to the shifting of manufacturing facilities to new regions. Furthermore, the COVID-19 pandemic has accelerated digitization in the business and educational sectors, which has accelerated the demand for computing devices and is fueling the market growth.

Authors: Suraj Gujar

Frequently Asked Questions (FAQ) :

The market share for thin wafers crossed USD 6.5 billion in annual revenue in 2020 and will grow at a CAGR of over 6% through 2027 with increasing demand for compact and miniaturized devices like smart wearables and smartphones.

The 100?m - 199?m wafer thickness segment held close to 50% of the thin wafer market share in 2020 and could observe a growth rate of 6% up to 2027 driven by increasing adoption in memory devices.

The overall market revenue from the temporary bonding and debonding process segment was valued at USD 250 million in 2020 and is expected to strike a CAGR of 7% by 2027.

The market size from LED applications will account for nearly 20% of the revenue share by 2027 due to the rising adoption of thin wafers in VCSEL technology.

South Korea thin wafer size was responsible for close to 25% of the revenue share in 2020 and will expand at a 6% CAGR through 2027 due to the strong presence of major semiconductor manufacturers across the region.

Thin Wafer Market Scope

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Premium Report Details

  • Base Year: 2020
  • Companies covered: 15
  • Tables & Figures: 232
  • Countries covered: 13
  • Pages: 232
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