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Thermally Conductive Filler Dispersants Market Trends

Report ID: GMI6448
Published Date: Aug 2023
Report Format: PDF

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Thermally Conductive Filler Dispersants Market Trends

As electronic devices continue to shrink in size while increasing in power, efficient heat dissipation becomes crucial. The trend toward smaller and thinner devices drives the demand for thermally conductive materials that can manage heat effectively in confined spaces. The rollout of 5G networks requires high-performance electronics that generate significant heat. Thermally conductive materials play a critical role in maintaining the performance and reliability of 5G infrastructure components.

Authors: Kiran Pulidindi, Kunal Ahuja

Frequently Asked Questions (FAQ) :

Global market for thermally conductive filler dispersants was valued at around USD 285 million in 2023 and is estimated to reach USD 719 million by the end of 2032.

Electronics and electricals segment will record around 7.2% CAGR from 2023 to 2032. As electronic devices become smaller and more powerful, the need for effective thermal management becomes even more critical to prevent thermal-related failures.

U.S. market size was USD 285 million in 2022 and will expand at a significant pace through 2032 as the nation is a hub for electronics and semiconductor manufacturing.

Henkel AG & Co. KGaA, Dow Inc., 3M Company, Shin-Etsu Chemical Co., Ltd., Momentive Performance Materials Inc., Saint-Gobain Performance Plastics, Indium Corporation, A. Schulman (LyondellBasell), Creative Materials Inc., Henan Sanyuan New Materials Co., Ltd., Masterbond, DKSH Group, Laird Performance Materials, Nusil Technology LLC, AI Technology, Inc. among others.