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Thermal Interface Materials Market Share

Report ID: GMI6752
Published Date: Sep 2023
Report Format: PDF

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Thermal interface materials Market Share

Some of the major industry players operating in the Thermal interface materials market are

Henkel Corporation
Dow Corning Corporation (now Dow, Inc.)
3M Company
Bergquist Company
Laird Technologies (now part of Renesas Electronics Corporation)
Shin-Etsu Chemical Co., Ltd.
Momentive Performance Materials Inc.
Parker Hannifin Corporation
Wakefield-Vette
Zalman Tech Co., Ltd.
Indium Corporation
Panasonic Corporation
Arctic Silver, Inc.
Fujipoly America Corporation
Master Bond Inc.

These players focus on strategic partnerships, new product launch & commercialization for market expansion. Furthermore, these players are heavily investing in research that allows them to introduce innovative products and garner maximum revenue in the market.

Authors: Kiran Pulidindi, Kunal Ahuja

Frequently Asked Questions (FAQ) :

Market size for thermal interface materials was USD 3.78 billion in 2022 and is estimated to reach USD 10.28 billion by the end of 2032 driven by the rising demand for sustainable and green packaging options due to surging environmental issues.

Thermal interface materials market size from the thermal greases and paste segment generated USD 1.41 billion in 2022 owing to rising demand to offer high thermal conductivity

U.S. industry size for thermal interface materials was USD 0.83 billion in 2022 and is expected to expand through 2032 owing to the rapid growth of data centers in the region

Some of the key thermal interface material providers are Henkel Corporation, Dow Corning Corporation (now Dow, Inc.), 3M Company, Bergquist Company, Laird Technologies (now part of Renesas Electronics Corporation), Shin-Etsu Chemical Co., Ltd., and Momentive Performance Materials Inc.,