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The increasing use of electronic components in consumer electronics, 5G technology, industrial automation, and automotive systems, is anticipated to help expand the above 10 inches SiC wafer reclaim services industry statistics. Manufacturers of electronic goods are more likely to incline towards adapting above 10 inches SiC wafers due to the benefits including high performance, energy efficiency, and low-cost integration. The above 10-inch segment is predicted to rise at around 10% growth rate through 2030.
The power devices segment is predicted to cross USD 700 million revenue by 2030. Rising demand for power devices in applications that operate on a wide range of frequencies and power levels has led to SiC wafer reclaim services market expansion.
The growth of the Asia Pacific SiC wafer reclaim services market is mostly attributed to the region’s rising population. The usage of technology and electronic goods has increased dramatically in rapidly urbanized economies like China, India, and Japan. In 2021, the Asia Pacific region dominated the market share of nearly 60%. The industry is depicting a high demand for SiC wafers from diverse verticals such as energy, automation telecommunications, consumer electronics and healthcare. .