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The semiconductor industry is increasingly focusing on smaller, more powerful nodes, including advanced technologies like 5nm, 3nm, and the upcoming 2nm nodes. Governments in developed regions are increasingly collaborating with chip manufacturers to enhance the construction of efficient nodes. For instance, in April 2024, TSMC signed a Memorandum of Understanding (MoU) with the U.S. Department of Commerce, securing USD 6.6 billion in direct funding under the CHIPS Act.
Manufacturing these nodes requires state-of-the-art facilities equipped with the latest photolithography, etching, and deposition equipment. This trend is driven by the growing demand for high-performance computing in areas such as artificial intelligence, machine learning, and data centers, as well as the evolving needs of next-generation consumer electronics and automotive technologies. Establishing plants capable of producing these advanced nodes necessitates significant investments in both technology and infrastructure. Additionally, companies are developing new materials and innovative manufacturing techniques, leading to continuous upgrades and expansions of existing facilities.