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The global semiconductor metrology and inspection market size was valued at USD 9.2 billion in 2023 and is expected to grow at a CAGR of over 5% between 2024 and 2032, due to the increasing demand for advanced semiconductor devices in consumer electronics and automotive applications. As chip complexity rises, the need for precise measurement and inspection technologies to ensure quality and performance has surged. Innovations in metrology tools that can handle smaller feature sizes and higher precision requirements are driving this expansion.
For instance, in December 2023, Hitachi High-Tech launched the GT2000 high-precision electron beam metrology system, advancing semiconductor metrology and inspection. The GT2000, with its ultra-low acceleration voltage and high-speed multi-point measurement, enhances imaging for High-NA EUV resist wafers. Hitachi High-Tech GT2000 CD-SEM will enable high-precision, high-speed measurements, and inspection in the manufacturing process of advanced semiconductor devices, which are becoming increasingly miniaturized and complex, and contribute to the improvement of customer yields in research-and-development and mass production.
Report Attribute | Details |
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Base Year: | 2023 |
Semiconductor Metrology and Inspection Market Size in 2023: | USD 9.2 Billion |
Forecast Period: | 2024 – 2032 |
Forecast Period 2024 – 2032 CAGR: | 5% |
2024 – 2032 Value Projection: | USD 15 Billion |
Historical Data for: | 2021-2023 |
No. of Pages: | 230 |
Tables, Charts & Figures: | 290 |
Segments covered: | Type, Technology, Application, End User |
Growth Drivers: |
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Pitfalls & Challenges: |
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Another significant growth driver for the semiconductor metrology and inspection market is the proliferation of IoT devices and 5G technology. The transition to these advanced technologies demands higher performance and reliability from semiconductors, necessitating enhanced inspection and metrology solutions. As manufacturers strive to meet stringent performance standards, investments in cutting-edge inspection tools and techniques are growing.
The high cost of advanced metrology and inspection equipment is a significant challenge in the market. Cutting-edge technologies, such as high-precision electron beam systems and High-NA EUV lithography tools, require substantial investment. These systems are not only expensive to purchase but also entail high maintenance costs and ongoing calibration expenses. For semiconductor manufacturers, particularly smaller players or those with limited financial resources, these costs can be prohibitive, potentially limiting their ability to adopt the latest technologies and stay competitive.