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Semiconductor Bonding Market Share

  • Report ID: GMI9233
  • Published Date: Apr 2024
  • Report Format: PDF

Semiconductor Bonding Market Share

ASM Pacific Technology Ltd and BE Semiconductor Industries N.V. (Besi) hold a significant share of over 15% in the market. ASM Pacific Technology Ltd holds a significant market share in the semiconductor bonding industry due to its advanced and comprehensive portfolio of bonding equipment. The company is known for its innovation in developing precision bonding technology, which is essential for producing reliable and high-quality semiconductor devices across various applications.
 

BE Semiconductor Industries N.V. (Besi) secures a major market share in the semiconductor bonding industry through its specialization in advanced packaging equipment. Besi's strength lies in its cutting-edge die-attach and packaging technologies that cater to the evolving needs of high-performance semiconductor manufacturing. The company's focus on continuous innovation, reliability, and efficiency in bonding solutions enhances its competitiveness and appeal to global semiconductor producers.
 

Semiconductor Bonding Market Companies

Major players operating in the industry are:

  • ASM Pacific Technology Ltd.
  • BE Semiconductor Industries N.V.
  • EV Group
  • Kulicke & Soffa Industries, Inc.
  • Intel Corporation
  • Panasonic Corporation
  • Mitsubishi Heavy Industries, Ltd.
     
Authors: Suraj Gujar, Deeksha Vishwakarma

Frequently Asked Questions (FAQ) :

The market size for semiconductor bonding was valued at over USD 900 million in 2023 and will grow at over 3% CAGR between 2024 and 2032, driven by the miniaturization of electronic devices.

The flip chip bonder type segment held a decent share in 2023 and will grow at over 5% CAGR during 2024 to 2032, owing to its importance in high-performance electronics.

Asia Pacific semiconductor bonding market accounted for a share of over 30% in 2023 and will expand rapidly till 2032, owing to the presence of some largest semiconductor manufacturing hubs.

ASM Pacific Technology Ltd., BE Semiconductor Industries N.V., EV Group, Kulicke & Soffa Industries, Inc., Intel Corporation, Panasonic Corporation, and Mitsubishi Heavy Industries, Ltd. among others.

Semiconductor Bonding Market Scope

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Premium Report Details

  • Base Year: 2023
  • Companies covered: 15
  • Tables & Figures: 287
  • Countries covered: 21
  • Pages: 250
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