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Semiconductor Bonding Equipment Market Share

Report ID: GMI11349
Published Date: Sep 2024
Report Format: PDF

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Semiconductor Bonding Equipment Market Share

Applied Materials, Inc. and ASMPT Ltd (ASM Pacific Technology) hold a significant share of over 20% in the market. Applied Materials, Inc. and Tokyo Electron Limited are industry leaders known for their comprehensive portfolios and global reach, offering cutting-edge solutions across various bonding technologies. ASMPT Ltd (ASM Pacific Technology) and Kulicke and Soffa Industries, Inc. are also prominent, particularly in wire bonding and die bonding equipment, where they leverage their expertise and innovation to maintain significant market shares.

EV Group (EVG) and BE Semiconductor Industries NV (Besi) are recognized for their advancements in wafer bonding and flip-chip technologies, focusing on high-precision and specialized bonding solutions that cater to advanced semiconductor applications. Canon Inc. also contributes significantly with its strong background in precision equipment, expanding its influence in the semiconductor market.

Semiconductor Bonding Equipment Market Companies

Major players operating in the semiconductor bonding equipment industry are:

Applied Materials, Inc.
ASMPT Ltd (ASM Pacific Technology)
Kulicke and Soffa Industries, Inc.
Tokyo Electron Limited
EV Group (EVG)
BE Semiconductor Industries NV (Besi)
Canon Inc.

Authors: Suraj Gujar , Sandeep Ugale

Frequently Asked Questions (FAQ) :

The market size for semiconductor bonding equipment was valued at USD 530.4 million in 2023 and is anticipated to register over 10% CAGR between 2024 and 2032 driven by increasing demand for chips across consumer electronics, automotive, telecommunications, and industrial applications.

The wire bonding equipment type segment in the semiconductor bonding equipment market accounted for over 39% revenue share in 2023, due to its longstanding dominance in semiconductor packaging.

Asia Pacific market held over 55% share in 2023, attributed to domination in semiconductor manufacturing and electronics production.

Applied Materials, Inc., ASMPT Ltd (ASM Pacific Technology, Kulicke and Soffa Industries, Inc., Tokyo Electron Limited, EV Group (EVG), BE Semiconductor Industries NV (Besi), and Canon Inc.