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The printed circuit board (PCB) assembly market is evolving with a focus on miniaturization, demanding intricate designs for compact electronics. Advanced assembly techniques are pivotal to meet these demands. Simultaneously, the surge in high-speed applications, such as 5G, necessitates PCBs capable of handling elevated frequencies and data rates. This evolution propels the development of specialized high-frequency PCBs to support the rapid advancements in technology and connectivity needs.
The PCB industry is embracing innovative materials including flexible PCBs and advanced substrates including ceramics & composites, catering to precise performance needs and ensuring enhanced reliability. Simultaneously, the pervasive rise of IoT and edge computing solutions is fueling the demand for specialized PCBs. These boards are engineered to support seamless connectivity, efficient sensor integration, and optimized power consumption, aligning with the unique requirements of IoT devices & edge computing systems in a rapidly evolving technological landscape.