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The power transistors market is witnessing a significant shift toward wide bandgap semiconductors, particularly SiC and GaN transistors. These materials are becoming increasingly popular due to their ability to handle higher voltages, faster switching speeds, and superior thermal performance as compared to the traditional silicon-based transistors. This trend is particularly strong in applications such as Electric Vehicles (EVs), renewable energy systems, and industrial automation, where efficiency and compactness are critical. As the cost of SiC and GaN technologies gradually decreases, their adoption is expected to grow further, driving innovations and performance improvements across various sectors.
Another emerging trend is the miniaturization of power transistors, driven by the demand for smaller & more energy-efficient electronic devices. This has led to the development of advanced packaging technologies, such as the Dual Flat No-lead (DFN) and Quad Flat No-lead (QFN) packages, which offer significant space savings on circuit boards. These modern packages not only reduce the footprint of power transistors but also enhance their thermal performance and reliability. This trend is aligned with the broader push toward compact, high-performance electronics in consumer devices, automotive electronics, and industrial applications.
For instance, in August 2024, Infineon's CoolGaN 650V transistors were selected by Vitesco Technologies for its Gen5+ GaN Air DC–DC converters, enhancing power density and efficiency. These GaN transistors, featuring high switching speeds and air-cooled packaging, allow for compact and cost-effective designs, achieving over 96% efficiency and significant board space savings.