Home > Semiconductors & Electronics > Semiconductor > Semiconductor Packaging > Interposer and Fan-out WLP Market

Interposer and Fan-out WLP Market Share

Report ID: GMI8177
Published Date: Feb 2024
Report Format: PDF

Download Free Sample

Interposer and Fan-out WLP Market Share

Taiwan Semiconductor Manufacturing Company Limited (TSMC) holds a significant share in the market. TSMC is a leading semiconductor foundry, offering advanced packaging solutions including fan-out WLPs to cater to the increasing demand for high-performance, compact electronic devices.

Major players, such as Amkor Technology, ASE Technology Holding Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, and Samsung are constantly implementing strategic measures, such as geographical expansion, acquisitions, mergers, collaborations, partnerships, and product or service launches, to gain market share.

Interposer and Fan-out WLP Market Companies

Major players operating in the interposer and fan-out WLP industry are:

ALLVIA, Inc.
AMETEK Inc.
Amkor Technology
ASE Technology Holding Co., Ltd.
ASTI Holdings Limited
Broadcom
Infineon Technologies AG
Intel Corporation
LAM RESEARCH CORPORATION
Murata Manufacturing Co., Ltd.
Powertech Technology Inc.
Qualcomm Technologies, Inc.
SAMSUNG
Siliconware Precision Industries Co.
STMicroelectronics
Taiwan Semiconductor Manufacturing Company Limited
Texas Instruments Incorporated
TOSHIBA CORPORATION
United Microelectronics Corporation

Authors: Suraj Gujar , Sandeep Ugale

Frequently Asked Questions (FAQ) :

Interposer and fan-out wafer-level packaging (FOWLP) industry accounted for more than USD 30 billion in 2023 and is set to expand at over 12% CAGR between 2024 and 2032 driven by the increasing use of advanced packaging solutions in wearables and smartphones.

The fan-out WLP (FOWLP) segment in the interposer and fan-out WLP industry is anticipated to witness over 13% CAGR during 2024-2032 as they offer numerous advantages over traditional packaging methods, including improved electrical performance, higher integration density, and better thermal management.

North America held more than 30% revenue share of the interposer and fan-out WLP market in 2023 and is estimated to exhibit robust growth through 2032 owing to the presence of many leading semiconductor companies, research institutions, and technology hubs in the region.

Some of the top firms engaged in the interposer and fan-out WLP industry are ALLVIA, Inc., AMETEK Inc., ASE Technology Holding Co., Ltd., ASTI Holdings Limited, Broadcom, Infineon Technologies AG, Intel Corporation, LAM RESEARCH CORPORATION, Murata Manufacturing Co., Ltd., Powertech Technology Inc., Qualcomm Technologies, Inc., SAMSUNG, STMicroelectronics, Taiwan Semiconductor Manufacturing Company Limited, and TOSHIBA CORPORATION, among others.