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The global InP wafer market size was valued at USD 170 million in 2023 and is anticipated to grow at a CAGR of 11.5% between 2024 and 2032. The demand for 200 mm compound semiconductor epi wafers is rising due to their ability to support higher-volume production and reduce per-unit costs in applications like photonics and optoelectronics.
Larger wafer sizes enable more devices to be manufactured simultaneously, making them more cost-effective for high-demand sectors, such as 3D sensing, automotive LiDAR, and telecommunications. Additionally, the compatibility of 200 mm wafers with existing silicon foundry infrastructure facilitates their integration into established production lines, accelerating adoption and driving further market growth for compound semiconductors.
For instance, In May 2022: A 200 mm (8) epiwafer for vertical-cavity surface-emitting laser (VCSEL) diodes was created by IQE in Wales. The cost of the laser for 3D sensors is expected to be drastically reduced by switching to a 200 mm compound semiconductor epi wafer. New foundry relationships may result from this, particularly those with high-volume silicon-based foundries that use 200 mm machinery. This may make it possible for compound semiconductors to be integrated into silicon, opening up a wider choice of devices and applications.
Report Attribute | Details |
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Base Year: | 2023 |
InP Wafer Market Size in 2023: | USD 170 Million |
Forecast Period: | 2024–2032 |
Forecast Period 2024–2032 CAGR: | 11.5% |
2024–2032 Value Projection: | USD 444.4 Million |
Historical Data for: | 2021–2023 |
No. of Pages: | 200 |
Tables, Charts & Figures: | 353 |
Segments covered: | By Diameter, Product Type, End-user Industry, Application |
Growth Drivers: |
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Pitfalls & Challenges: |
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