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High Frequency High Speed Copper Clad Laminate (CCL) Market Trends

Report ID: GMI11053
Published Date: Aug 2024
Report Format: PDF

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High Frequency High Speed Copper Clad Laminate Market Trends

The latest trend in the market is the accelerated development of materials specifically designed for 5G applications. As 5G networks require ultra-high-frequency signals and rapid data transmission, the demand for advanced CCLs that can meet these stringent requirements is rising. Manufacturers are increasingly focusing on enhancing the dielectric properties, thermal management, and signal integrity of CCLs to support the infrastructure needed for 5G technology. This trend is driving innovation in material science, with companies investing heavily in research and development to create CCLs that can efficiently handle the challenges of 5G deployment, such as reduced signal loss and improved durability under high-frequency conditions.

For instance, in August 2023, Hitachi Chemical Co., Ltd. began mass production of the MCL-HS200 laminate material. This material is designed for 5G applications, providing low transmission loss and low warpage properties, essential for high-frequency circuit boards.

Authors: Suraj Gujar, Rutvij Kshirsagar

Frequently Asked Questions (FAQ) :

The high frequency high speed copper clad laminate (CCL) market size was valued at USD 3.55 billion in 2023 and is anticipated to witness over 5% CAGR between 2024 and 2032 primarily driven by the increasing demand for high-performance electronic devices

The 5G base stations application segment in the high frequency high speed copper clad laminate (CCL) industry is expected to reach over USD 20 billion by 2032 as they meet the increasing data demands and enable advanced technologies

North America industry accounted for over 35% share in 2023 owing to significant investments in telecommunications, data centers, and high-speed internet infrastructure.

Hitachi Chemical Co., Ltd., Kingboard Laminates Holdings Ltd., Mitsubishi Gas Chemical Company, Inc., Panasonic Corporation, Rogers Corporation, Shengyi Technology Co., Ltd., and Taiwan Union Technology Corporation (TUC)