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As electronic devices continue to shrink in size and boost performance, the need for effective thermal management solutions has surged. Hexagonal boron nitride, celebrated for its superior thermal conductivity and electrical insulation properties, is witnessing a growing adoption in thermal interface materials (TIMs) and substrates for cutting-edge electronic components.
Premium grade segment was valued at USD 517.3 million in 2024, and it is anticipated to expand to 6% of CAGR during 2025-2034. Industries such as electronics, aerospace, and semiconductors are increasingly demanding premium-grade hBN, known for its high purity and performance. This grade boasts exceptional thermal conductivity, electrical insulation, and chemical inertness, making it perfect for cutting-edge applications, including thermal interface materials and substrates for high-frequency devices. The burgeoning markets for 5G infrastructure and electric vehicles (EVs) have propelled the demand for premium grade hBN. Furthermore, its application in aerospace, particularly for thermal shielding and lightweight composite materials, is gaining momentum, bolstered by manufacturing process advancements that guarantee consistent quality.
The hexagonal boron nitride market from thermal management segment was valued at USD 319 million in 2024 and gained 6.2% CAGR from 2025 to 2034. Due to its unmatched thermal conductivity, hBN has emerged as a pivotal material in thermal management systems, particularly within the electronics and automotive sectors. Its usage is on the rise in thermal interface materials, catering to microprocessors, power modules, and LED lighting. With the trend of devices shrinking in size yet gaining power, hBN's capability in effective heat dissipation is proving to be increasingly vital. Furthermore, hBN's integration into EV batteries and charging systems is expanding, fueled by the imperative to boost safety and efficiency.
The electronics & semiconductor segment was valued at USD 433.3 million in 2024 and gained an 6.1% CAGR from 2025 to 2034. The electronics and semiconductor industry stands as the predominant consumer of hBN, primarily due to its essential functions in thermal management and electrical insulation. As 5G networks, IoT devices, and electric vehicles (EVs) expand, the demand for hBN in substrates, thermal interface materials (TIMs), and dielectric layers is on the rise. Furthermore, the growing trend of utilizing hBN nanosheets in advanced semiconductor applications underscores its significance in the realm of nanotechnology.
U.S. hexagonal boron nitride market was valued at USD 307 million in 2024 and expected to grow at a 6.4% CAGR till 2034. The U.S. dominates the global hBN market, fueled by its strong electronics, aerospace, and automotive sectors. The nation's commitment to technological innovation has heightened the demand for hBN in areas like thermal management systems and electrical insulation for semiconductors. As the electric vehicle (EV) market rapidly expands, hBN's role in battery systems and lightweight composites has surged. Additionally, investments by the U.S. Department of Defense in advanced materials for aerospace and defense—such as thermal shields and high-temperature-resistant coatings—further propel this growth.