Glass Substrate Market Trends

Glass Substrate Market Trends

The growing adoption of glass substrate in semiconductor packaging industry is witnessing a surge in demand for low-temperature co-fired ceramic (LTCC) substrates owing to their superior thermal and electrical characteristics. High heat conductivity, little dielectric loss, and interoperability with a broad variety of semiconductor devices are some benefits of LTCC substrates. These substrates are a popular option for manufacturers trying to enhance the performance of their semiconductor packages as they are especially well-suited for high-frequency and applications that require considerable power. Glass substrates that can handle advanced packaging technologies such as FOWLP (fan-out wafer-level packaging) and SiP (system-in-package). Glass substrates with intricate geometry and high-density are being developed by manufacturers, opening the door for semiconductor packages to use cutting-edge packaging techniques. For instance, in Sept 2023, Intel unveiled one of the first glass substrates in the industry for next-generation advanced packaging. This ground-breaking technology will allow transistors in a package to continue scaling, resulting in data-centric applications.
 

The growing adoption of wearable electronics represents an ongoing trend in the glass substrate market, fostering demand for specialized substrates tailored to the unique requirements of wearable devices. With the increasing demand for fitness trackers, Augmented Reality (AR) glasses, and other wearable gadgets, there is a growing need for advanced glass substrates capable of enduring the demands of daily use while delivering optimal performance. For instance, in November 2023, Humane, an electronics company, launched its flagship product, AI Pin, a wearable AI assistant with a ‘less is more’ approach. The lapel-worn device utilizes AI as a daily assistant at the size of a smartwatch and the power of a smartphone.