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The global shift towards renewable energy, particularly solar energy, is a major driver for the market. Flexible substrates are essential in the manufacturing of thin-film photovoltaic (PV) cells, which are lightweight, flexible, and can be applied to various surfaces, including rooftops and portable devices. These substrates enable the production of flexible and rollable solar panels, which are easier to install and more adaptable to different environments than traditional rigid panels. The increasing investment in renewable energy infrastructure and the rising demand for portable solar solutions are driving the adoption of flexible substrates in this sector. For instance, in August 2024, researchers at MIT announced a breakthrough in the development of a new flexible substrate designed for electronic devices, with the goal of significantly reducing electronic waste (e-waste). This innovative substrate is engineered to be both highly durable and environmentally friendly, addressing the growing global concern over e-waste, which has become one of the fastest-growing waste streams worldwide.
Flexible printed circuit boards (FPCBs) are a crucial application of flexible substrates, widely used in various electronic devices, including smartphones, laptops, cameras, and industrial equipment. The increasing miniaturization of electronic components and the need for complex circuitry in compact spaces are driving the adoption of FPCBs. Flexible substrates offer the necessary flexibility, heat resistance, and durability required for these applications. Innovations in materials, such as polyimide films and advanced laminates, are further enhancing the performance and reliability of FPCBs, supporting their growing adoption across industries. For instance, in April 2024, DuPont unveiled the DuPont Pyralux ML Series, a new line of double-sided metal-clad laminates, expanding its renowned Pyralux family for flexible and rigid-flex printed circuit boards (PCBs). Engineered for superior thermal management, these laminates are tailored to meet the rigorous demands of high-reliability sectors such as aerospace, defense, electric vehicles (EVs), AI-related networking, and other advanced electronic devices.