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Fan-Out Wafer Level Packaging Market Trends

Report ID: GMI5810
Published Date: May 2023
Report Format: PDF

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Fan-Out Wafer Level Packaging Market Trends

The rising global demand for a wide range of electronic devices as well as the growing trend of miniaturization is expected to drive the demand for fan-out wafer level packaging during the forecast period. The increasing use of semiconductor ICs in IoT devices is propelling the global fan-out wafer level packaging industry statistics. The development of wired & wireless communication technologies, telecommunication standards such as 3G/4G/5G, and government initiatives to implement energy-efficient systems & solutions are driving the demand for these IoT devices. The growing number of IoT applications will increase the demand for IoT chipsets that are integrated into these devices. Wi-Fi modules, RF modules, FOWLP units (MCUs), and sensor modules are among the chipsets used in these IoT devices.

Authors: Suraj Gujar

Frequently Asked Questions (FAQ) :

Fan-out wafer level packaging (FOWLP) market size was over USD 2.5 billion in 2022 and will record over 10% CAGR from 2023-2032 driven by the rising adoption of advanced and cost-effective packaging technologies

Fan-out wafer level packaging market share from the high-density packaging process segment surpassed USD 1.5 billion in 2022 due to the rising investments in the development of high-density solutions.

Fan-out wafer level packaging industry share from the automotive application segment will expand at 15% CAGR from 2023-2032 owing to the surging requirements for reliability and electro-thermal co-simulation

Asia Pacific recorded over 50% of the fan-out wafer level packaging market share in 2022 owing to the strong presence of numerous foundries and OSAT companies in the region