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Fan-Out Wafer Level Packaging Market Share

Report ID: GMI5810
Published Date: May 2023
Report Format: PDF

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Fan-Out Wafer Level Packaging Market Share

Some of the major players operating in the fan-out wafer level packaging market are

Amkor Technology
ASE Technology Holding Co., Ltd.
Deca Technologies
GlobalFoundries Inc.
JCET Group Co., Ltd.
Nepes Corporation
Powertech Technology Inc.
Siliconware Precision Industries Co., Ltd.

These players focus on strategic partnerships and new product launches & commercialization for market expansion. Furthermore, these players are heavily investing in research, allowing them to introduce innovative processes and garner maximum revenue in the market.

Authors: Suraj Gujar

Frequently Asked Questions (FAQ) :

Fan-out wafer level packaging (FOWLP) market size was over USD 2.5 billion in 2022 and will record over 10% CAGR from 2023-2032 driven by the rising adoption of advanced and cost-effective packaging technologies

Fan-out wafer level packaging market share from the high-density packaging process segment surpassed USD 1.5 billion in 2022 due to the rising investments in the development of high-density solutions.

Fan-out wafer level packaging industry share from the automotive application segment will expand at 15% CAGR from 2023-2032 owing to the surging requirements for reliability and electro-thermal co-simulation

Asia Pacific recorded over 50% of the fan-out wafer level packaging market share in 2022 owing to the strong presence of numerous foundries and OSAT companies in the region