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Board-to-Board Connectors Market Trends

  • Report ID: GMI7815
  • Published Date: Jan 2024
  • Report Format: PDF

Board-to-Board Connectors Market Trends

The trend toward faster data transfers in electronics has led to the development of high-speed board-to-board connectors. These connectors support the applications requiring high bandwidth such as 5G networks and gaming devices. Miniaturization remains a prominent trend. Connectors are becoming smaller, which is crucial for applications such as wearables and IoT devices. Manufacturers are innovating to balance size and performance. Based on increasing product adoption in rugged environments, such as automotive and aerospace, there is a trend toward more robust & durable board-to-board connectors that can withstand extreme conditions such as temperature variations and vibrations. To cater to diverse applications, connectors are increasingly being customized. Modular connectors allow engineers to design tailored solutions, reducing development time and costs.
 

There was a growing demand for smaller connectors capable of accommodating higher densities of connections within limited spaces. Miniaturization was a key trend, driven by the need for more compact and efficient electronic devices across industries like consumer electronics, automotive, and portable devices. Manufacturers were focusing on developing connectors using new materials and advanced designs to improve signal integrity, reduce signal loss, and ensure better electrical performance. Materials with enhanced thermal properties and improved conductivity were being explored for better connector efficiency.

Authors: Suraj Gujar , Deeksha Vishwakarma

Frequently Asked Questions (FAQ) :

Market size for board-to-board connectors crossed USD 10.9 billion in 2023 and is expected to register over 5% CAGR from 2024-2032 owing to an increasing need for efficient interconnect solutions to link various components within electronic devices worldwide.

The pin headers component segment held over 60% share of the board-to-board connectors industry in 2023 owing to their ability to offer a simple & cost-effective means of creating temporary connections for testing and validation purposes.

Asia Pacific held over 30% share of the board-to-board connectors industry in 2023 and is expected to register commendable CAGR from 2024-2032 due to rapid urbanization and infrastructure development in the region.

Amphenol Corporation, TE Connectivity, Japan Aviation Electronics (JAE), Hirose Electric Co. Ltd., Molex, Omron Corporation, and Samtec are some of the major board-to-board connectors companies worldwide.

Board-to-Board Connectors Market Scope

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Premium Report Details

  • Base Year: 2023
  • Companies covered: 16
  • Tables & Figures: 274
  • Countries covered: 19
  • Pages: 250
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