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Innovations such as Silicon Carbide (SiC) and Gallium Nitride (GaN) semiconductor materials have significantly enhanced power module performance and efficiency. These advanced materials boast superior thermal conductivity, quicker switching speeds, and enhanced energy efficiency over conventional silicon-based semiconductors. Integrated power modules, capable of managing elevated power densities and functioning at higher temperatures, are now ideally suited for electric and hybrid vehicles with demanding powertrain systems. Moreover, advancements in system integration and miniaturization are enabling the creation of more compact, reliable, and cost-effective integrated power modules that are crucial for next-generation vehicles.
A significant pitfall for the market is the complexity of thermal management. Integrated power modules operate under high power loads and experience significant heat generation due to the power conversion and switching processes involved. Effective thermal management is crucial to prevent overheating, maintain system reliability, and ensure the longevity of modules. However, as vehicle powertrains become more powerful, managing the heat within IPMs becomes increasingly challenging.