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Advanced Packaging Market Trends

Report ID: GMI4831
Published Date: Jan 2024
Report Format: PDF

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Advanced Packaging Market Trends

Advanced packaging leverages 3D integration with semiconductor layers stacked for improved performance and a reduced footprint. This enables the development of denser and more efficient electronic devices, catering to the demand for enhanced functionality in smaller form factors.

Heterogeneous integration in the advanced packaging industry entails merging diverse materials and technologies within a unified package. This strategic approach addresses the intricate demands of modern electronic components, promoting enhanced performance and functionality. By combining disparate elements such as different semiconductor materials or technologies within a single package, heterogeneous integration optimizes the overall system, fostering efficiency and meeting the evolving requirements of advanced electronic devices in terms of speed, power consumption, and versatility.

Authors: Suraj Gujar

Frequently Asked Questions (FAQ) :

Market size for advanced packaging crossed USD 30 billion in 2023 and is expected to register over 10% CAGR from 2024-2032 owing to an increasing trend of IoT and AI technologies worldwide.

The flip-chip packaging type segment held over 60% share advanced packaging industry in 2023 and is expected to register an appreciable CAGR from 2024-2032 owing to its ability to offer shorter interconnection lengths for reducing signal delays and improving overall electrical performance.

Asia Pacific held over 65% share of the advanced packaging industry in 2023 and is expected to register commendable CAGR from 2024-2032 due to the presence of a strong electronics manufacturing ecosystem in the region.

Amkor Technology, ASE Group, JCET Group Co., Ltd., Powertech Technology Inc., Taiwan Semiconductor Manufacturing Company Limited, TongFu Microelectronics Co., Ltd., and UTAC are some of the major advanced packaging companies worldwide.