Home > Semiconductors & Electronics > Semiconductor > Semiconductor Packaging > Advanced Packaging Market

Advanced Packaging Market Share

Report ID: GMI4831
Published Date: Jan 2024
Report Format: PDF

Download Free Sample

Advanced Packaging Market Share

Players operating in the advanced packaging industry focus on implementing different growth strategies to strengthen their offerings and expand their market reach. These strategies involve new product developments & launches, partnerships & collaborations, mergers & acquisitions, and customer retention. These players also heavily invest in research & development to introduce innovative and technologically advanced solutions in the market.

Advanced Packaging Market Share

Some of the major players operating in the advanced packaging industry are:

Amkor Technology
ASE Group
JCET Group Co., Ltd.
Powertech Technology Inc.
Taiwan Semiconductor Manufacturing Company Limited
TongFu Microelectronics Co., Ltd.
UTAC

Authors: Suraj Gujar

Frequently Asked Questions (FAQ) :

Market size for advanced packaging crossed USD 30 billion in 2023 and is expected to register over 10% CAGR from 2024-2032 owing to an increasing trend of IoT and AI technologies worldwide.

The flip-chip packaging type segment held over 60% share advanced packaging industry in 2023 and is expected to register an appreciable CAGR from 2024-2032 owing to its ability to offer shorter interconnection lengths for reducing signal delays and improving overall electrical performance.

Asia Pacific held over 65% share of the advanced packaging industry in 2023 and is expected to register commendable CAGR from 2024-2032 due to the presence of a strong electronics manufacturing ecosystem in the region.

Amkor Technology, ASE Group, JCET Group Co., Ltd., Powertech Technology Inc., Taiwan Semiconductor Manufacturing Company Limited, TongFu Microelectronics Co., Ltd., and UTAC are some of the major advanced packaging companies worldwide.