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3D IC and 2.5D IC Packaging Market Share

Report ID: GMI5933
Published Date: Jun 2023
Report Format: PDF

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3D IC and 2.5D IC Packaging Market Share

Major companies operating in the 3D IC and 2.5D IC packaging market include:

Advanced Semiconductor Engineering (ASE)
Amkor Technology
Broadcom
ChipMOS Technologies Inc
Intel Corporation
Jiangsu Changjiang Electronics Technology (JCET)
Mitsubishi Electric Corporation
Powertech Technology Inc. (PTI)
Samsung Electronics
Siliconware Precision Industries (SPIL)
Texas Instrument
Toshiba Corporation
TSMC (Taiwan Semiconductor Manufacturing Company)
United Microelectronics Corporation (UMC), and Xilinx Inc.

Authors: Suraj Gujar

Frequently Asked Questions (FAQ) :

Market size for 3D IC and 2.5D IC packaging was USD 45 billion in 2022 and will record over 9% CAGR between 2023 and 2032.

The 3D wafer-level chip-scale market held over 25% share by 2022 as 3D WLCSP refers to a packaging technology where multiple chips or dies are stacked vertically and the interconnections between them are made at the wafer level.

Asia Pacific 3D IC and 2.5D IC packaging industry will observe over 10% CAGR from 2023 to 2032 as it is home to some of the largest semiconductor chip manufacturers including TSMC, SMIC, UMC, and Samsung.

Amkor Technology, ChipMOS Technologies Inc., Texas Instrument, Intel Corporation, Mitsubishi Electric Corporation, Samsung Electronics, Advanced Semiconductor Engineering (ASE), Broadcom, Toshiba Corporation, Xilinx Inc., and United Microelectronics Corporation (UMC).